Invention Grant
- Patent Title: Electronic module and method for the production thereof
- Patent Title (中): 电子模块及其制造方法
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Application No.: US14009144Application Date: 2012-02-29
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Publication No.: US09271399B2Publication Date: 2016-02-23
- Inventor: Holger Braun , Helmut Bubeck , Matthias Lausmann , Ralf Schinzel , Klaus Voigtlaender , Thomas Mueller , Benjamin Bertsch
- Applicant: Holger Braun , Helmut Bubeck , Matthias Lausmann , Ralf Schinzel , Klaus Voigtlaender , Thomas Mueller , Benjamin Bertsch
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Michael Best & Friedrich LLP
- Priority: DE102011006622 20110401
- International Application: PCT/EP2012/053422 WO 20120229
- International Announcement: WO2012/130549 WO 20121004
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/30 ; H05K1/02 ; H05K5/00 ; F16H61/00 ; H05K3/00
Abstract:
The invention relates to an electronic module, a support plate (2) having a base area (20) and at least one connection element (21). Said connection element (21) is a part of the base area (20) and is arranged at an angle (a) to the base area (20), in addition to at least one electronic component (3), in particular a sensor, which is arranged in the connection element (21).
Public/Granted literature
- US20140029220A1 ELECTRONIC MODULE AND METHOD FOR THE PRODUCTION THEREOF Public/Granted day:2014-01-30
Information query
