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1.
公开(公告)号:US09360348B2
公开(公告)日:2016-06-07
申请号:US14233809
申请日:2012-06-01
Applicant: Stephan Henzler , Wolfgang Woernle , Alexander Herrmann , Benjamin Bertsch
Inventor: Stephan Henzler , Wolfgang Woernle , Alexander Herrmann , Benjamin Bertsch
CPC classification number: G01D11/245 , G01D11/30 , G01L19/143
Abstract: The invention relates to a sensor device (10), in particular for use in a motor vehicle, having a housing (11) for accommodating a sensor element (1), wherein the sensor element (1) has electrical contact areas (2, 3) which are connected to electrical plug connections (18, 19) arranged in the housing (11) in an electrically conductive manner in the region of contacts (23, 24) of the plug connections (18, 19), wherein a force is applied to the sensor element (1) for the purpose of making electrical contact with a housing element in the direction of the plug connections (18, 19). The invention provides for the electrical plug connections (18, 19) to be arranged in a stationary manner in the housing (11) in the region of the contacts (23, 24) with the electrical contact areas (2, 3) of the sensor element (1), and for a support to be formed between the sensor element (1) and the housing (11) in such a manner that the sensor element (1) has three-point contact in the housing (11).
Abstract translation: 本发明涉及一种特别用于机动车辆的传感器装置(10),其具有用于容纳传感器元件(1)的壳体(11),其中传感器元件(1)具有电接触区域(2,3) ),其连接到在插头连接件(18,19)的触头(23,24)的区域中以导电方式布置在壳体(11)中的电插头连接件(18,19),其中施加力 到传感器元件(1),以便在插头连接(18,19)的方向上与壳体元件电接触。 本发明提供了在触头(23,24)的区域中以固定方式布置在壳体(11)中的电插头连接(18,19),其中传感器的电接触区域(2,3) 元件(1),以及用于在传感器元件(1)和壳体(11)之间形成的支撑件,使得传感器元件(1)在壳体(11)中具有三点接触。
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公开(公告)号:US20140240927A1
公开(公告)日:2014-08-28
申请号:US14009166
申请日:2012-02-29
Applicant: Holger Braun , Helmut Bubeck , Matthias Lausmann , Ralf Schinzel , Klaus Voigtlaender , Thomas Mueller , Benjamin Bertsch
Inventor: Holger Braun , Helmut Bubeck , Matthias Lausmann , Ralf Schinzel , Klaus Voigtlaender , Thomas Mueller , Benjamin Bertsch
CPC classification number: H05K7/06 , B60Y2400/30 , F16H61/0006 , H05K1/0203 , H05K1/021 , H05K1/0233 , H05K1/182 , H05K3/0061 , H05K5/0082 , H05K7/2039 , H05K7/20509 , H05K2201/10151
Abstract: The invention relates to an electronic module comprising at least one electronic or electric component (3), a base plate (4), and a support plate (2), in particular a printed circuit board or a substrate. Said support plate (2) is arranged on the base plate (4) and comprises conductor paths. Said base plate (4) comprises a blind hole-type recess (5) on a side oriented towards the support plate (2). The component (3) is in contact on the support plate (2) and is arranged in the recess (5) of the base plate (4).
Abstract translation: 本发明涉及一种电子模块,其包括至少一个电子或电气部件(3),基板(4)和支撑板(2),特别是印刷电路板或基板。 所述支撑板(2)布置在基板(4)上并且包括导体路径。 所述基板(4)在朝向支撑板(2)的方向上包括盲孔型凹部(5)。 部件(3)在支撑板(2)上接触并且布置在基板(4)的凹部(5)中。
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公开(公告)号:US09271418B2
公开(公告)日:2016-02-23
申请号:US14009166
申请日:2012-02-29
Applicant: Holger Braun , Helmut Bubeck , Matthias Lausmann , Ralf Schinzel , Klaus Voigtlaender , Thomas Mueller , Benjamin Bertsch
Inventor: Holger Braun , Helmut Bubeck , Matthias Lausmann , Ralf Schinzel , Klaus Voigtlaender , Thomas Mueller , Benjamin Bertsch
CPC classification number: H05K7/06 , B60Y2400/30 , F16H61/0006 , H05K1/0203 , H05K1/021 , H05K1/0233 , H05K1/182 , H05K3/0061 , H05K5/0082 , H05K7/2039 , H05K7/20509 , H05K2201/10151
Abstract: The invention relates to an electronic module comprising at least one electronic or electric component (3), a base plate (4), and a support plate (2), in particular a printed circuit board or a substrate. Said support plate (2) is arranged on the base plate (4) and comprises conductor paths. Said base plate (4) comprises a blind hole-type recess (5) on a side oriented towards the support plate (2). The component (3) is in contact on the support plate (2) and is arranged in the recess (5) of the base plate (4).
Abstract translation: 本发明涉及一种电子模块,其包括至少一个电子或电气部件(3),基板(4)和支撑板(2),特别是印刷电路板或基板。 所述支撑板(2)布置在基板(4)上并且包括导体路径。 所述基板(4)在朝向支撑板(2)的方向上包括盲孔型凹部(5)。 部件(3)在支撑板(2)上接触并且布置在基板(4)的凹部(5)中。
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4.
公开(公告)号:US20140137656A1
公开(公告)日:2014-05-22
申请号:US14233809
申请日:2012-06-01
Applicant: Stephan Henzler , Wolfgang Woernle , Alexander Herrmann , Benjamin Bertsch
Inventor: Stephan Henzler , Wolfgang Woernle , Alexander Herrmann , Benjamin Bertsch
IPC: G01D11/24
CPC classification number: G01D11/245 , G01D11/30 , G01L19/143
Abstract: The invention relates to a sensor device (10), in particular for use in a motor vehicle, having a housing (11) for accommodating a sensor element (1), wherein the sensor element (1) has electrical contact areas (2, 3) which are connected to electrical plug connections (18, 19) arranged in the housing (11) in an electrically conductive manner in the region of contacts (23, 24) of the plug connections (18, 19), wherein a force is applied to the sensor element (1) for the purpose of making electrical contact with a housing element in the direction of the plug connections (18, 19). The invention provides for the electrical plug connections (18, 19) to be arranged in a stationary manner in the housing (11) in the region of the contacts (23, 24) with the electrical contact areas (2, 3) of the sensor element (1), and for a support to be formed between the sensor element (1) and the housing (11) in such a manner that the sensor element (1) has three-point contact in the housing (11).
Abstract translation: 本发明涉及一种特别用于机动车辆的传感器装置(10),其具有用于容纳传感器元件(1)的壳体(11),其中传感器元件(1)具有电接触区域(2,3) ),其连接到在插头连接件(18,19)的触头(23,24)的区域中以导电方式布置在壳体(11)中的电插头连接(18,19),其中施加力 到传感器元件(1),以便在插头连接(18,19)的方向上与壳体元件电接触。 本发明提供了在触头(23,24)的区域中以固定方式布置在壳体(11)中的电插头连接(18,19),其中传感器的电接触区域(2,3) 元件(1),以及用于在传感器元件(1)和壳体(11)之间形成的支撑件,使得传感器元件(1)在壳体(11)中具有三点接触。
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公开(公告)号:US09271399B2
公开(公告)日:2016-02-23
申请号:US14009144
申请日:2012-02-29
Applicant: Holger Braun , Helmut Bubeck , Matthias Lausmann , Ralf Schinzel , Klaus Voigtlaender , Thomas Mueller , Benjamin Bertsch
Inventor: Holger Braun , Helmut Bubeck , Matthias Lausmann , Ralf Schinzel , Klaus Voigtlaender , Thomas Mueller , Benjamin Bertsch
CPC classification number: H05K1/181 , B60Y2400/30 , F16H61/0006 , H05K1/0278 , H05K1/028 , H05K1/0284 , H05K3/0061 , H05K3/30 , H05K5/0082 , H05K2201/09081 , H05K2201/10151 , H05K2203/302 , Y10T29/4913
Abstract: The invention relates to an electronic module, a support plate (2) having a base area (20) and at least one connection element (21). Said connection element (21) is a part of the base area (20) and is arranged at an angle (a) to the base area (20), in addition to at least one electronic component (3), in particular a sensor, which is arranged in the connection element (21).
Abstract translation: 本发明涉及电子模块,具有基座区域(20)和至少一个连接元件(21)的支撑板(2)。 除了至少一个电子部件(3),特别是传感器之外,所述连接元件(21)是基部区域(20)的一部分并且与基部区域(20)成角度(a)布置, 其布置在连接元件(21)中。
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公开(公告)号:US20140029220A1
公开(公告)日:2014-01-30
申请号:US14009144
申请日:2012-02-29
Applicant: Holger Braun , Helmut Bubeck , Matthias Lausmann , Ralf Schinzel , Klaus Voigtlaender , Thomas Mueller , Benjamin Bertsch
Inventor: Holger Braun , Helmut Bubeck , Matthias Lausmann , Ralf Schinzel , Klaus Voigtlaender , Thomas Mueller , Benjamin Bertsch
CPC classification number: H05K1/181 , B60Y2400/30 , F16H61/0006 , H05K1/0278 , H05K1/028 , H05K1/0284 , H05K3/0061 , H05K3/30 , H05K5/0082 , H05K2201/09081 , H05K2201/10151 , H05K2203/302 , Y10T29/4913
Abstract: The invention relates to an electronic module, a support plate (2) having a base area (20) and at least one connection element (21). Said connection element (21) is a part of the base area (20) and is arranged at an angle (a) to the base area (20), in addition to at least one electronic component (3), in particular a sensor, which is arranged in the connection element (21).
Abstract translation: 本发明涉及电子模块,具有基座区域(20)和至少一个连接元件(21)的支撑板(2)。 除了至少一个电子部件(3),特别是传感器之外,所述连接元件(21)是基部区域(20)的一部分并且与基部区域(20)成角度(a)布置, 其布置在连接元件(21)中。
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