Invention Grant
- Patent Title: Electronic module
- Patent Title (中): 电子模块
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Application No.: US14009166Application Date: 2012-02-29
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Publication No.: US09271418B2Publication Date: 2016-02-23
- Inventor: Holger Braun , Helmut Bubeck , Matthias Lausmann , Ralf Schinzel , Klaus Voigtlaender , Thomas Mueller , Benjamin Bertsch
- Applicant: Holger Braun , Helmut Bubeck , Matthias Lausmann , Ralf Schinzel , Klaus Voigtlaender , Thomas Mueller , Benjamin Bertsch
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Michael Best & Friedrich LLP
- Priority: DE102011006632 20110401
- International Application: PCT/EP2012/053420 WO 20120229
- International Announcement: WO2012/130548 WO 20121004
- Main IPC: H05K7/06
- IPC: H05K7/06 ; H05K7/20 ; H05K1/02 ; H05K1/18 ; H05K3/00 ; H05K5/00 ; F16H61/00

Abstract:
The invention relates to an electronic module comprising at least one electronic or electric component (3), a base plate (4), and a support plate (2), in particular a printed circuit board or a substrate. Said support plate (2) is arranged on the base plate (4) and comprises conductor paths. Said base plate (4) comprises a blind hole-type recess (5) on a side oriented towards the support plate (2). The component (3) is in contact on the support plate (2) and is arranged in the recess (5) of the base plate (4).
Public/Granted literature
- US20140240927A1 ELECTRONIC MODULE Public/Granted day:2014-08-28
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