- 专利标题： Electronic device and method for fabricating an electronic device
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申请号： US13282927申请日： 2011-10-27
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公开(公告)号： US09275973B2公开(公告)日： 2016-03-01
- 发明人: Khalil Hosseini , Frank Kahlmann
- 申请人： Khalil Hosseini , Frank Kahlmann
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/00 ; H01L23/29 ; H01L23/31 ; H01L21/56 ; H01L29/40 ; H01L23/552
摘要：
An embodiment electronic device comprises a semiconductor chip including a first main face, a second main face and side faces each connecting the first main face to the second main face. A metal layer is disposed above the second main face and the side faces, the metal layer including a porous structure.
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