Invention Grant
- Patent Title: Integrated circuit package
- Patent Title (中): 集成电路封装
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Application No.: US14706052Application Date: 2015-05-07
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Publication No.: US09275983B2Publication Date: 2016-03-01
- Inventor: Lee Han Meng@ Eugene Lee , Anis Fauzi bin Abdul Aziz , Yien Sien Khoo
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frank D. Cimino
- Main IPC: H04L21/00
- IPC: H04L21/00 ; H01L25/00 ; H01L23/495 ; H01L21/56 ; H01L23/498 ; H01L25/16 ; H01L23/31 ; H01L23/00
Abstract:
A method of making an integrated circuit (IC) package including electrically and physically attaching a die to an interposer, attaching the interposer to a bottom leadframe, attaching a discrete circuit component to the interposer and attaching a top leadframe to the bottom leadframe.
Public/Granted literature
- US20150243641A1 INTEGRATED CIRCUIT PACKAGE Public/Granted day:2015-08-27
Information query
