Invention Grant
- Patent Title: Methods of manufacturing semiconductor devices
- Patent Title (中): 制造半导体器件的方法
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Application No.: US14732260Application Date: 2015-06-05
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Publication No.: US09276058B2Publication Date: 2016-03-01
- Inventor: Sung-Ho Lee , Jin Choi , Yong-Ho Yoo , Jong-Hyuk Kang , Hyun-Joo Cha , Hee-Dong Park , Tae-Jung Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2011-0069188 20110713
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L49/02

Abstract:
A semiconductor device includes a plurality of lower electrodes on a substrate, with each of the lower electrodes extending in a height direction from the substrate and including sidewalls, the lower electrodes being spaced apart from each other in a first direction and in a second direction, a plurality of first supporting layer patterns contacting the sidewalls of the lower electrodes, the first supporting layer patterns extending in the first direction between ones of the lower electrodes adjacent in the second direction, a plurality of second supporting layer patterns contacting the sidewalls of the lower electrodes, the second supporting layer pattern extending in the second direction between ones of the lower electrodes adjacent in the first direction, the plurality of second supporting layer patterns being spaced apart from the plurality of first supporting layer patterns in the height direction.
Public/Granted literature
- US20150270330A1 METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES Public/Granted day:2015-09-24
Information query
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