Invention Grant
- Patent Title: Method of manufacturing stretchable substrate and stretchable substrate manufactured using the method
- Patent Title (中): 使用该方法制造可拉伸基材和可拉伸基材的方法
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Application No.: US14243768Application Date: 2014-04-02
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Publication No.: US09276119B2Publication Date: 2016-03-01
- Inventor: Ji-Young Oh , Jae Bon Koo , Sang Chul Lim , Chan Woo Park , Soon-Won Jung , Bock Soon Na , Sang Seok Lee , Hye Yong Chu
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Priority: KR10-2013-0098057 20130819
- Main IPC: H01L29/786
- IPC: H01L29/786 ; B29C59/02 ; B29C43/02 ; B29C71/04 ; B29C43/18 ; B29C43/20 ; B29K75/00 ; B29K21/00 ; B29K83/00 ; B29C35/02
Abstract:
Provided is a method of manufacturing a gradually stretchable substrate. The method includes forming convex regions and concave regions on a top surface of a stretchable substrate by compressing a mold onto the stretchable substrate and forming non-stretchable patterns by filling the concave regions of the stretchable substrate. The stretchable substrate includes a stretchable region defined by the non-stretchable patterns, the non-stretchable patterns have side surfaces in contact with the stretchable region, and the side surfaces of the non-stretchable patterns are formed of protrusions and a non-protrusion between the protrusions repetitively connected to one another.
Public/Granted literature
- US20150048375A1 METHOD OF MANUFACTURING STRETCHABLE SUBSTRATE AND STRETCHABLE SUBSTRATE MANUFACTURED USING THE METHOD Public/Granted day:2015-02-19
Information query
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