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公开(公告)号：US09864251B2
公开(公告)日：2018-01-09
申请号：US15007844
申请日：2016-01-27
发明人： Ji-Young Oh , Jae Bon Koo , Joo Yeon Kim , Bock Soon Na , Chan Woo Park , Sang Seok Lee , Soon-Won Jung , Seong-Mok Cho , Hye Yong Chu
CPC分类号： G02F1/155 , G02F2001/1519
摘要： Provided is a color changeable device which includes a first substrate and a second substrate that are spaced apart from each other, a first transparent electrode disposed on the first substrate, a second transparent electrode disposed on the second substrate, an electrochromic layer disposed between the first transparent electrode and the second transparent electrode, an organic layer disposed between the first transparent electrode and the electrochromic layer. The organic layer may include a hole injection layer or an electron injection layer. The organic layer may further include a hole transport layer or an electron transport layer.
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公开(公告)号：US09740073B2
公开(公告)日：2017-08-22
申请号：US15007912
申请日：2016-01-27
发明人： Ji-Young Oh , Jae Bon Koo , Joo Yeon Kim , Bock Soon Na , Chan Woo Park , Sang Seok Lee , Soon-Won Jung , Hye Yong Chu
CPC分类号： G02F1/155 , G02F1/15 , G02F1/153 , G02F1/157 , G02F2001/1552 , G02F2001/1555 , G02F2201/44 , G09G3/38
摘要： Provided is a complex display device Including a first substrate and an opposed second substrate, a first electrode, an electrochromic layer, a common electrode, an emission part and a second electrode, laminated between the first substrate and the second substrate one by one, and an organic layer disposed between the first electrode and the electrochromic layer, or between the electrochromic layer and the common electrode. The organic layer of the complex display device may include at least one of a hole injection material, a hole transport material and a mixture thereof, or at least one of an electron injection material, an electron transport material or a mixture thereof.
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公开(公告)号：US09842669B2
公开(公告)日：2017-12-12
申请号：US15220866
申请日：2016-07-27
发明人： Chan Woo Park , Jae Bon Koo , Bock Soon Na , Rae-Man Park , Ji-Young Oh , Sang Seok Lee , Soon-Won Jung
IPC分类号： H01B7/00 , H01B7/06 , H01B13/008 , H05K1/02
CPC分类号： H01B7/06 , H01B13/008 , H05K1/0283 , H05K3/007 , H05K3/107 , H05K3/20 , H05K2201/0329 , H05K2201/0338 , H05K2201/035 , H05K2203/016 , H05K2203/0568 , H05K2203/128
摘要： A stretchable wire including a stretchable solid-phase conductive structure; a stretchable insulation layer which surrounds the solid-phase conductive structure; and a liquid-phase conductive material layer disposed between the solid-phase conductive structure and the stretchable insulation layer, and in contact with the solid-phase conductive structure, and a method of fabricating the same.
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公开(公告)号：US09059512B2
公开(公告)日：2015-06-16
申请号：US13929735
申请日：2013-06-27
发明人： Sang Seok Lee , Seongdeok Ahn , Jae Bon Koo
摘要： The present invention relates to a radio communication antenna and a radio communication device including the same. The radio communication antenna of the present invention includes first conductive wires extending in opposite directions with respect to a first direction on a substrate to form a dipole antenna, second conductive wires separated from the first conductive wires to be parallel with the first conductive wires, and stubs connected between the first conductive wires and the second conductive wires in a second direction intersecting with the first direction.
摘要翻译： 无线电通信天线和包括该无线电通信天线的无线电通信装置技术领域本发明涉及无线电通信天线和包括该无线电通信天线的无线电通信装置。 本发明的无线电通信天线包括在基板上相对于第一方向相反方向延伸的第一导线，以形成偶极子天线，与第一导线分开的与第一导线平行的第二导线，以及 在与第一方向相交的第二方向上连接在第一导线和第二导线之间的短截线。
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5.发明授权公开(公告)号：US09331126B2
公开(公告)日：2016-05-03
申请号：US14280578
申请日：2014-05-17
发明人： Sang Seok Lee , Kyoung Ik Cho , Bock Soon Na , Sang Chul Lim , Chan Woo Park , Soon-Won Jung , Jae Bon Koo , Hye Yong Chu
CPC分类号： H01L27/3244 , H01L51/003 , H01L51/0094 , H01L51/0097 , H01L51/56 , Y02E10/549
摘要： Provided is a method for fabricating a flexible display device. The method includes attaching a shape memory alloy film memorizing a shape thereof as a curved shape at a shape memory temperature or lower to a flexible substrate at a temperature higher than the shape memory temperature, forming a display device on the flexible substrate, and returning the shape memory alloy to the curved shape to remove the shape memory alloy film from the flexible substrate.
摘要翻译： 提供一种制造柔性显示装置的方法。 该方法包括将形状记忆合金膜在高于形状记忆温度的温度下将其形状记忆温度保持为形状记忆温度以下的形状记忆合金薄膜，形成柔性基板，在柔性基板上形成显示装置， 形状记忆合金到弯曲形状，以从柔性基底去除形状记忆合金膜。
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6.发明授权公开(公告)号：US09276119B2
公开(公告)日：2016-03-01
申请号：US14243768
申请日：2014-04-02
发明人： Ji-Young Oh , Jae Bon Koo , Sang Chul Lim , Chan Woo Park , Soon-Won Jung , Bock Soon Na , Sang Seok Lee , Hye Yong Chu
IPC分类号： H01L29/786 , B29C59/02 , B29C43/02 , B29C71/04 , B29C43/18 , B29C43/20 , B29K75/00 , B29K21/00 , B29K83/00 , B29C35/02
CPC分类号： H01L29/78603 , B29C35/0266 , B29C43/021 , B29C43/18 , B29C43/203 , B29C59/02 , B29C71/04 , B29K2021/00 , B29K2075/00 , B29K2083/00 , H01L27/1218 , H01L27/1225 , H01L27/1262 , H01L29/7869 , Y10T428/19
摘要： Provided is a method of manufacturing a gradually stretchable substrate. The method includes forming convex regions and concave regions on a top surface of a stretchable substrate by compressing a mold onto the stretchable substrate and forming non-stretchable patterns by filling the concave regions of the stretchable substrate. The stretchable substrate includes a stretchable region defined by the non-stretchable patterns, the non-stretchable patterns have side surfaces in contact with the stretchable region, and the side surfaces of the non-stretchable patterns are formed of protrusions and a non-protrusion between the protrusions repetitively connected to one another.
摘要翻译： 提供一种制造逐渐拉伸基材的方法。 该方法包括通过将模具压缩到可拉伸基底上并在可伸缩基底的凹部填充而形成不可拉伸图案，在可拉伸基底的顶表面上形成凸区域和凹区域。 可拉伸基材包括由不可拉伸图案限定的可拉伸区域，不可拉伸图案具有与可拉伸区域接触的侧表面，并且不可拉伸图案的侧表面由突起和非伸缩图案之间的非突起形成 突起重复地彼此连接。
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公开(公告)号：US10026844B2
公开(公告)日：2018-07-17
申请号：US15461567
申请日：2017-03-17
发明人： Kyoung Ik Cho , Jae Bon Koo , Chan Woo Park , Bock Soon Na , Sang Seok Lee , Sang Chul Lim , Soon-Won Jung , Hye Yong Chu
IPC分类号： H01L29/10 , H01L29/786 , H01L29/66 , H01L27/12 , H01L21/3105 , H01L21/311
摘要： Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
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公开(公告)号：US09865559B2
公开(公告)日：2018-01-09
申请号：US15220145
申请日：2016-07-26
发明人： Chan Woo Park , Jae Bon Koo , Bock Soon Na , Rae-Man Park , Ji-Young Oh , Sang Seok Lee , Soon-Won Jung
IPC分类号： H01L23/00 , H01L21/683
CPC分类号： H01L24/43 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L2221/6835 , H01L2224/24137 , H01L2924/00014 , H01L2224/45099
摘要： Provided is a method for manufacturing a stretchable wire, the method including removing a portion of a photoresist layer on a substrate to form a photoresist pattern comprising at least one pattern slit, applying a liquid-phase conductive material on the photoresist pattern to form a liquid-phase conductive structure in the pattern slit, forming a stretchable first insulating layer on the liquid-phase conductive structure, after removing the photoresist pattern, and separating the liquid-phase conductive structure and the first insulating layer from the substrate.
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公开(公告)号：US09634120B2
公开(公告)日：2017-04-25
申请号：US14610410
申请日：2015-01-30
发明人： Kyoung Ik Cho , Jae Bon Koo , Chan Woo Park , Bock Soon Na , Sang Seok Lee , Sang Chul Lim , Soon-Won Jung , Hye Yong Chu
IPC分类号： H01L29/10 , H01L29/66 , H01L29/786 , H01L27/12 , H01L21/3105
CPC分类号： H01L29/78603 , H01L21/3105 , H01L21/31058 , H01L21/31144 , H01L27/1218 , H01L27/1266 , H01L29/66742
摘要： Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
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公开(公告)号：US09177821B2
公开(公告)日：2015-11-03
申请号：US14259042
申请日：2014-04-22
发明人： Soon-Won Jung , Jae Bon Koo , Chan Woo Park , Bock Soon Na , Sang Chul Lim , Sang Seok Lee , Kyoung Ik Cho , Hye Yong Chu
IPC分类号： H01L21/338 , H01L21/311 , H01L29/66
CPC分类号： H01L21/311 , G09F9/301 , H01L29/66477 , H01L51/0023 , H01L51/0055 , H01L51/0525 , H01L51/102 , H05K1/0283 , H05K1/0333 , H05K1/16 , H05K3/0017 , H05K3/007 , H05K2201/0133 , H05K2201/0162 , H05K2201/09036 , H05K2201/09045 , H05K2201/10166 , H05K2201/2009 , H05K2203/308
摘要： Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.
摘要翻译： 提供一种制造电子电路的方法。 该方法包括制备基底，在基底上形成聚合物膜，图案化聚合物膜以形成聚合物图案，并在聚合物图案上形成电子器件。
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