Invention Grant
- Patent Title: Combined wiring board and method for manufacturing the same
- Patent Title (中): 组合线路板及其制造方法
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Application No.: US14542721Application Date: 2014-11-17
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Publication No.: US09277655B2Publication Date: 2016-03-01
- Inventor: Teruyuki Ishihara , Michimasa Takahashi
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-236518 20131115
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/36 ; H05K1/14 ; H05K1/02
Abstract:
A combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent portion or adhesive agent portions, and a metal frame having an accommodation opening portion formed to accommodate the wiring board set such that the wiring board set is positioned in the accommodation opening portion of the metal frame.
Public/Granted literature
- US20150136453A1 COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2015-05-21
Information query
