Invention Grant
- Patent Title: Electron beam writing apparatus and electron beam writing method
- Patent Title (中): 电子束写入装置和电子束写入方法
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Application No.: US14614948Application Date: 2015-02-05
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Publication No.: US09281161B2Publication Date: 2016-03-08
- Inventor: Hideki Matsui
- Applicant: NuFlare Technology, Inc.
- Applicant Address: JP Yokohama-shi
- Assignee: NuFlare Technology, Inc.
- Current Assignee: NuFlare Technology, Inc.
- Current Assignee Address: JP Yokohama-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-099725 20140513
- Main IPC: H01J37/305
- IPC: H01J37/305 ; H01L21/027 ; H01J37/147 ; H01J37/317

Abstract:
An electron beam writing apparatus includes: a first aperture plate that shapes an electron beam emitted from an electron gun assembly; a second aperture plate onto which an electron beam of an aperture plate image passing through the first aperture plate is projected; and a first shaping deflector and a second shaping deflector which are provided between the first aperture plate and the second aperture plate, respectively, deflect an electron beam, control an irradiation position of the aperture plate image on the second aperture plate, and determine a shot shape and a shot size. The first shaping deflector deflects an electron beam such that the aperture plate image is positioned at a determined position in accordance with a shot shape and a shot size. The second shaping deflector deflects an electron beam deflected by the first shaping deflector and controls formation of a desirable shot size.
Public/Granted literature
- US20150332890A1 ELECTRON BEAM WRITING APPARATUS AND ELECTRON BEAM WRITING METHOD Public/Granted day:2015-11-19
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