Invention Grant
- Patent Title: Connector assemblies for receiving implantable medical leads
- Patent Title (中): 用于接收可植入医疗引线的连接器组件
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Application No.: US14212091Application Date: 2014-03-14
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Publication No.: US09283372B2Publication Date: 2016-03-15
- Inventor: Spencer M. Bondhus , Patrick D. Wells
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: MEDTRONIC, INC.
- Current Assignee: MEDTRONIC, INC.
- Current Assignee Address: US MN Minneapolis
- Agency: Withers & Keys, LLC
- Main IPC: A61N1/00
- IPC: A61N1/00 ; A61N1/05

Abstract:
Connector assemblies that are separate from medical lead extensions provide features such as bores for receiving both a medical lead and a medical lead extension and provide electrical connections between connectors of the leads and connectors of the lead extensions. Connector assemblies may include additional features such as contours and wings that reduce subcutaneous erosion. Connector assemblies may also include retention structures such as movable clips that are moved into engagement with leads and lead extensions to retain them within the connector assembly. Integrated lead extension connectors may also include contours and wings as well as retention structures including movable clips.
Public/Granted literature
- US20140273602A1 Connector Assemblies for Receiving Implantable Medical Leads Public/Granted day:2014-09-18
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