Invention Grant
- Patent Title: Method for producing pressure-sensitive adhesive tape package
- Patent Title (中): 压敏胶带包装生产方法
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Application No.: US14353107Application Date: 2012-10-23
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Publication No.: US09283738B2Publication Date: 2016-03-15
- Inventor: Takafumi Miyachika , Kiyotaka Takada
- Applicant: HISAMITSU PHARMACEUTICAL CO., INC.
- Applicant Address: JP Saga
- Assignee: Hisamitsu Pharmaceutical Co., Inc.
- Current Assignee: Hisamitsu Pharmaceutical Co., Inc.
- Current Assignee Address: JP Saga
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg; Tanya E. Harkins
- Priority: JPP2011-233069 20111024
- International Application: PCT/JP2012/077321 WO 20121023
- International Announcement: WO2013/061951 WO 20130502
- Main IPC: A61F13/02
- IPC: A61F13/02 ; B32B37/26 ; B32B38/00 ; A61F13/00 ; C09J7/02
Abstract:
An object of the present invention is to provide a method for producing a pressure-sensitive adhesive tape package suitable for mass production. The production method according to the present invention aims at producing a pressure-sensitive adhesive tape package which is a pressure-sensitive adhesive tape package 10 accommodating a pressure-sensitive adhesive tape 14 having a support 18 and an adhesive agent layer 12 provided on one surface of the support 18, the pressure-sensitive adhesive tape package comprising a release sheet 16 to which the adhesive agent layer of the adhesive tape is releasably attached. In this method, the adhesive tape 14 is bonded to the release sheet base material 116, and folded in two. Subsequently, a plurality of adhesive tapes 14 is heat sealed and temporarily attached to one release sheet base material 116, and the release sheet base material 116 is cut.
Public/Granted literature
- US20140246144A1 METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE TAPE PACKAGE Public/Granted day:2014-09-04
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