Invention Grant
- Patent Title: Wireless bus for intra-chip and inter-chip communication, including data center/server embodiments
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Application No.: US13793719Application Date: 2013-03-11
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Publication No.: US09286121B2Publication Date: 2016-03-15
- Inventor: Ahmadreza Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
- Applicant: Broadcom Corporation
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: G06F9/50
- IPC: G06F9/50 ; H04W4/00 ; H04B5/00 ; H04B7/10 ; H04W84/18 ; H04B7/26
Abstract:
Embodiments of the present invention are directed to a wire-free data center/server. The data center/server is wire-free in the sense that communication within a data unit of the data center/server (i.e., intra-data unit), between data units of the data center/server (inter-data unit), and between the data units and the backplane of the data center/server is performed wirelessly.
Public/Granted literature
- US20130191567A1 Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Data Center/Server Embodiments Public/Granted day:2013-07-25
Information query
