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    Reflective beamforming for performing chip-to-chip and other communications
    1.
    发明授权
    Reflective beamforming for performing chip-to-chip and other communications 有权
    用于执行芯片到芯片和其他通信的反射波束成形

    公开(公告)号：US09543645B2

    公开(公告)日：2017-01-10

    申请号：US14613982

    申请日：2015-02-04

    申请人： Broadcom Corporation

    发明人： Farid Shirinfar ,  Maryam Rofougaran ,  Ahmadreza Rofougaran

    IPC分类号： H01Q3/00 ,  H04B1/00 ,  H01Q1/22 ,  H01Q15/00 ,  H04B15/00

    CPC分类号： H01Q3/00 ,  H01Q1/2283 ,  H01Q15/006 ,  H04B1/00 ,  H04B15/00

    摘要： A transmitter front-end for wireless chip-to-chip communication, and for other, longer-range (e.g., several meters or several tens of meters) device-to-device communication is disclosed. The transmitter front-end can include a plurality of reflector power amplifiers implemented on an IC chip and an on-chip or on-package antenna for wireless transmitting a signal to another IC chip or device. The plurality of reflector power amplifiers can reflect the radiation of the on-chip or on-package antenna in a particular pattern such that the effective radiation pattern is reinforced in a desired direction and suppressed in an undesired direction. This helps to reduce the required output power of the transmitter front-end and mitigate interference with other potential wireless chip-to-chip or longer-range communications.

    摘要翻译： 公开了用于无线芯片到芯片通信的发射机前端，以及用于其他更长距离（例如，几米或几十米）设备到设备通信的发射机前端。 发射机前端可以包括实现在IC芯片上的多个反射器功率放大器和用于将信号无线发射到另一个IC芯片或设备的片上或封装天线。 多个反射器功率放大器可以以特定图案反映片上或封装内天线的辐射，使得有效辐射图案在期望的方向上被加强并且在不期望的方向上被抑制。 这有助于减少发射机前端的所需输出功率，并减轻与其他潜在的无线芯片到芯片或更远距离通信的干扰。

    Configurable transceiver
    5.
    发明授权
    Configurable transceiver 有权
    可配置收发器

    公开(公告)号：US09258782B2

    公开(公告)日：2016-02-09

    申请号：US14500959

    申请日：2014-09-29

    申请人： BROADCOM CORPORATION

    发明人： Ahmadreza Rofougaran

    IPC分类号： H04B17/00 ,  H04W52/02 ,  H04B1/40 ,  H04W24/02 ,  H04B1/00

    CPC分类号： H04W52/0238 ,  H04B1/0028 ,  H04B1/40 ,  H04W24/02 ,  Y02D70/40

    摘要： A configurable transceiver may include a configurable receiver, a configurable transmitter, and a digital signal processor (DSP). One or more components of the configurable receiver and/or the configurable transmitter may be a block that includes an array of components, such as an array of amplifiers, an array of filters, etc. The DSP may determine a configuration of the configurable receiver that satisfies a bit error rate threshold and minimizes power consumption. The DSP may configure the blocks of the configurable receiver in accordance with the determined configuration of the configurable receiver. The DSP may receive an indication of a modulation scheme being used for transmitted data and may determine a configuration of the configurable transmitter for the modulation scheme that satisfies an error vector magnitude threshold and minimizes power consumption. The DSP may configure the blocks of the configurable transmitter in accordance with the determined configuration of the configurable transmitter.

    摘要翻译： 可配置收发器可以包括可配置接收器，可配置发射器和数字信号处理器（DSP）。 可配置接收器和/或可配置发射器的一个或多个组件可以是包括诸如放大器阵列，滤波器阵列等的组件阵列的块.DSP可以确定可配置接收器的配置， 满足误码率阈值并最大限度地降低功耗。 DSP可以根据所确定的可配置接收器的配置来配置可配置接收器的块。 DSP可以接收用于发射数据的调制方案的指示，并且可以确定用于调制方案的可配置发射机的配置，该配置发射机满足误差矢量幅度阈值并使功耗最小化。 DSP可以根据可配置发射机的确定配置来配置可配置发射机的块。

    Radio Circuits and Components Thereof Including Temperature Responsive Liquid MEMS
    6.
    发明申请
    Radio Circuits and Components Thereof Including Temperature Responsive Liquid MEMS 审中-公开
    包括温度响应液体MEMS的无线电电路及其组件

    公开(公告)号：US20150330842A1

    公开(公告)日：2015-11-19

    申请号：US14810676

    申请日：2015-07-28

    申请人： Broadcom Corporation

    发明人： Ahmadreza Rofougaran

    IPC分类号： G01K7/34

    CPC分类号： G01K7/343 ,  H01G5/0132 ,  H01G5/16 ,  H01H2029/008 ,  H04B1/40

    摘要： A radio circuit includes an adjustable RF front-end module on an IC die, a liquid MEMS component on a board, and a processing module on the IC die. The adjustable RF front-end module adjusts processing of an inbound or an outbound RF signal based on a compensation control signal. The liquid MEMS component changes an operational characteristic as temperature of the radio circuit varies. The processing module generates the compensation signal based on the changing of the operational characteristic of the liquid MEMS component. The liquid MEMS component includes a channel within the board, a liquid droplet contained within the channel, and one or more conductive elements proximal to the channel.

    摘要翻译： 无线电电路包括IC芯片上的可调RF前端模块，板上的液体MEMS部件和IC芯片上的处理模块。 可调RF前端模块根据补偿控制信号调整入站或出站RF信号的处理。 随着无线电电路的温度变化，液体MEMS组件改变了操作特性。 处理模块基于液体MEMS部件的操作特性的变化产生补偿信号。 液体MEMS部件包括板内的通道，容纳在通道内的液滴和靠近通道的一个或多个导电元件。

    Independent power consumption management in a MIMO transceiver and method for use therewith
    7.
    发明授权
    Independent power consumption management in a MIMO transceiver and method for use therewith 有权
    MIMO收发机中的独立功耗管理及其使用方法

    公开(公告)号：US09131440B2

    公开(公告)日：2015-09-08

    申请号：US13858353

    申请日：2013-04-08

    申请人： BROADCOM CORPORATION

    发明人： Ahmadreza Rofougaran

    IPC分类号： H01Q11/12 ,  H04B1/04 ,  H04B7/00 ,  H04W52/02 ,  H04W52/24

    CPC分类号： H04W52/02 ,  H04W52/245 ,  Y02D70/1224 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/146 ,  Y02D70/166 ,  Y02D70/168 ,  Y02D70/23

    摘要： An integrated circuit (IC) includes a multi-input multi-output transceiver system that includes a plurality of RF transceivers. Each RF transceiver includes an RF transmitter that transmits a transmit signal at a selected transmit power, based on a transmit power control signal and a corresponding RF receiver for receiving a corresponding one of a plurality of received signals from an external device and for generating a signal strength indication corresponding to each of the plurality of received signals. A processing module generates the transmit power control signal for each RF transmitter based on the signal strength indication of the corresponding RF receiver, and that generates a power mode signal for adjusting a power consumption parameter of each RF transmitter in accordance with the selected transmit power for each RF transmitter.

    摘要翻译： 集成电路（IC）包括多输入多输出收发器系统，其包括多个RF收发器。 每个RF收发器包括RF发射器，其基于发射功率控制信号以及对应的RF接收机以所选择的发射功率发送发射信号，用于从外部设备接收多个接收信号中的对应的一个并产生信号 强度指示对应于多个接收信号中的每一个。 处理模块基于相应RF接收机的信号强度指示，为每个RF发射机产生发射功率控制信号，并且根据所选择的发射功率产生用于调整每个RF发射机的功率消耗参数的功率模式信号 每个射频发射机。

    METHOD AND SYSTEM FOR 60 GHZ DISTRIBUTED COMMUNICATION
    8.
    发明申请
    METHOD AND SYSTEM FOR 60 GHZ DISTRIBUTED COMMUNICATION 有权
    60 GHZ分布式通信方法与系统

    公开(公告)号：US20150180515A1

    公开(公告)日：2015-06-25

    申请号：US14638711

    申请日：2015-03-04

    申请人： Broadcom Corporation

    发明人： Ahmadreza Rofougaran ,  Maryam Rofougaran

    IPC分类号： H04B1/00 ,  H04B1/26

    CPC分类号： H04B1/0071 ,  H04B7/0608 ,  H04W88/04 ,  H04W88/06

    摘要： Methods and systems for 60 GHz distributed communication are disclosed and may include generating IF signals from baseband signals in a computing device with wireless capability. The IF signals may be communicated to remote RF modules within the computing device via coaxial lines. The IF signals may be up-converted to RF signals and transmitted via the RF modules. The IF signals in the coaxial lines may be tapped via taps coupled to the RF modules. The baseband signals may comprise video data, Internet streamed data, and/or data from a local data source. The RF signals may be communicated to a display device. Control signals for the RF devices may be communicated utilizing the coaxial lines. One or more of the RF devices may be selected based on a direction to a receiving device. The remote RF devices may comprise mixers. The RF signals may comprise 60 GHz signals.

    摘要翻译： 公开了用于60GHz分布式通信的方法和系统，并且可以包括在具有无线能力的计算设备中从基带信号产生IF信号。 IF信号可以经由同轴线路传送到计算设备内的远程RF模块。 IF信号可以被上变频成RF信号并通过RF模块传输。 可以通过耦合到RF模块的抽头来抽头同轴线路中的IF信号。 基带信号可以包括来自本地数据源的视频数据，因特网流数据和/或数据。 RF信号可以被传送到显示设备。 可以使用同轴线路来传送用于RF设备的控制信号。 可以基于对接收设备的方向来选择一个或多个RF设备。 远程RF设备可以包括混合器。 RF信号可以包括60GHz信号。

    Identifying defective components on a wafer using component triangulation
    9.
    发明授权
    Identifying defective components on a wafer using component triangulation 有权
    使用组件三角测量在晶圆上识别缺陷组件

    公开(公告)号：US09046576B2

    公开(公告)日：2015-06-02

    申请号：US13944430

    申请日：2013-07-17

    申请人： Broadcom Corporation

    发明人： Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

    IPC分类号： G01R31/00 ,  G01R31/319 ,  G01R31/302 ,  G01R31/311 ,  H01L23/544 ,  G01R31/28

    CPC分类号： G01R31/319 ,  G01R31/2834 ,  G01R31/3025 ,  G01R31/311 ,  H01L23/544 ,  H01L2223/54433 ,  H01L2924/0002 ,  Y10T29/49121 ,  H01L2924/00

    摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

    摘要翻译： 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。

    Waveguide for intra-package data transfer
    10.
    发明授权
    Waveguide for intra-package data transfer 有权
    波导用于封装内数据传输

    公开(公告)号：US09026061B2

    公开(公告)日：2015-05-05

    申请号：US13725062

    申请日：2012-12-21

    申请人： Broadcom Corporation

    发明人： Ahmadreza Rofougaran

    IPC分类号： H04B1/38 ,  H01P3/12 ,  H04B1/40 ,  H01P5/08 ,  H01L23/00

    CPC分类号： H04B1/40 ,  H01L24/80 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2924/00014 ,  H01L2924/1903 ,  H01P5/087 ,  H01L2224/13099 ,  H01L2224/29099

    摘要： An integrated chip (IC) package may include a waveguide that comprises a cavity, a first chip and a second chip. The first chip includes a first radio frequency (RF) transceiver that may be coupled to a first probe that extends into the cavity of the waveguide and/or a first antenna that is positioned over a first opening in the waveguide. The second chip includes a second RF transceiver that may be coupled to a second probe that extends into the cavity of the waveguide and/or a second antenna that is positioned over a second opening in the waveguide. The first and second chips may be configured to communicate with one another exclusively by the first and second RF transceivers transmitting and receiving RF signals through the cavity of the waveguide via the first and second probes and/or the first and second antennas.

    摘要翻译： 集成芯片（IC）封装可以包括包括空腔，第一芯片和第二芯片的波导。 第一芯片包括第一射频（RF）收发器，其可以耦合到延伸到波导的空腔中的第一探针和/或定位在波导中的第一开口上方的第一天线。 第二芯片包括第二RF收发器，其可以耦合到延伸到波导的空腔中的第二探针和/或定位在波导中的第二开口上的第二天线。 第一和第二芯片可以被配置为仅通过第一和第二RF收发器经由第一和第二探头和/或第一和第二天线通过波导的空腔发送和接收RF信号。