发明授权
US09287199B2 CMOS transistor, semiconductor device including the transistor, and semiconductor module including the device
有权
CMOS晶体管,包括晶体管的半导体器件和包括该器件的半导体模块
- 专利标题: CMOS transistor, semiconductor device including the transistor, and semiconductor module including the device
- 专利标题(中): CMOS晶体管,包括晶体管的半导体器件和包括该器件的半导体模块
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申请号: US12972961申请日: 2010-12-20
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公开(公告)号: US09287199B2公开(公告)日: 2016-03-15
- 发明人: Hye-Lan Lee , Hong-Bae Park , Sang-Jin Hyun , Yu-Gyun Shin , Sug-Hun Hong , Hoon-Joo Na , Hyung-Seok Hong
- 申请人: Hye-Lan Lee , Hong-Bae Park , Sang-Jin Hyun , Yu-Gyun Shin , Sug-Hun Hong , Hoon-Joo Na , Hyung-Seok Hong
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Onello & Mello, LLP
- 优先权: KR10-2010-0006553 20100125
- 主分类号: H01L23/522
- IPC分类号: H01L23/522 ; H01L23/485 ; H01L21/8238 ; H01L27/06 ; H01L27/08 ; H01L29/94
摘要:
Provided are a CMOS transistor, a semiconductor device having the transistor, and a semiconductor module having the device. The CMOS transistor may include first and second interconnection structures respectively disposed in first and second regions of a semiconductor substrate. The first and second regions of the semiconductor substrate may have different conductivity types. The first and second interconnection structures may be disposed on the semiconductor substrate. The first interconnection structure may have a different stacked structure from the second interconnection structure. The CMOS transistor may be disposed in the semiconductor device. The semiconductor device may be disposed in the semiconductor module.
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