Invention Grant
- Patent Title: Leadless semiconductor package with optical inspection feature
- Patent Title (中): 无铅半导体封装，具有光学检测功能
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Application No.: US14094207Application Date: 2013-12-02
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Publication No.: US09287238B2Publication Date: 2016-03-15
- Inventor: Soon Lock Goh , Swee Kah Lee
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495 ; H01L23/31 ; H01L21/56 ; H01L21/48
Abstract:
A semiconductor package includes a plurality of bond pads having a first side and a second side opposing the first side, a coating covering the first side of the bond pads, semiconductor dies and electrical conductors attached to the second side of the bond pads, and a molding compound encasing the semiconductor dies and the electrical conductors at the second side of the bonds pads. The molding compound has a first side through which the bond pads protrude and a second side opposing the first side, the first side of the molding compound having a planar surface between adjacent ones of the bond pads. The package further includes a material plated on exposed sidewalls of the bonds pads uncovered by the molding compound and which is detectable by optical inspection. A corresponding method of manufacture is also provided.
Public/Granted literature
- US20150155229A1 Leadless Semiconductor Package with Optical Inspection Feature Public/Granted day:2015-06-04
Information query
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