- 专利标题: Semiconductor device and method for manufacturing the same
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申请号: US13587361申请日: 2012-08-16
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公开(公告)号: US09287400B2公开(公告)日: 2016-03-15
- 发明人: Toshiaki Iwamatsu , Takashi Terada , Hirofumi Shinohara , Kozo Ishikawa , Ryuta Tsuchiya , Kiyoshi Hayashi
- 申请人: Toshiaki Iwamatsu , Takashi Terada , Hirofumi Shinohara , Kozo Ishikawa , Ryuta Tsuchiya , Kiyoshi Hayashi
- 申请人地址: JP Tokyo
- 专利权人: RENESAS ELECTRONICS CORPORATION
- 当前专利权人: RENESAS ELECTRONICS CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2007-273679 20071022
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L29/78 ; H01L29/66 ; H01L21/265
摘要:
An object of the present invention is to provide a semiconductor device having a fin-type transistor that is excellent in characteristics by forming a fin-shaped semiconductor portion and a gate electrode with high precision or by making improvement regarding variations in characteristics among elements. The present invention is a semiconductor device including a fin-shaped semiconductor portion having a source region formed on one side thereof and a drain region formed on the other side thereof, and a gate electrode formed between the source region and the drain region to surround the fin-shaped semiconductor portion with a gate insulating film interposed therebetween. One solution for solving the problem according to the invention is that the gate electrode uses a metal material or a silicide material that is wet etchable.
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