Invention Grant
- Patent Title: Light emitting diode package
- Patent Title (中): 发光二极管封装
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Application No.: US14124974Application Date: 2012-02-02
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Publication No.: US09287477B2Publication Date: 2016-03-15
- Inventor: Jae Jin Lee , Sung Ho Choi , Duk In Kang
- Applicant: Jae Jin Lee , Sung Ho Choi , Duk In Kang
- Applicant Address: KR Ansan-si
- Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2011-0055333 20110608; KR10-2011-0078257 20110805
- International Application: PCT/KR2012/000800 WO 20120202
- International Announcement: WO2012/169717 WO 20121213
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L51/50 ; H01L33/62 ; H01L33/64

Abstract:
An LED package includes a lead frame, a housing part, and a lead heat dissipating part. The lead frame includes a first lead mounting an LED chip and a second lead spaced apart from the first lead. The housing part covers a portion of the lead frame and includes an opening part for exposing the LED chip, a first side corresponding to a support side contacting the first lead and the second lead, and a second side opposite to the first side. The lead heat dissipating part is extended from the first lead and exposed partially to the first side of the housing part. Herein, the first side of the housing part is thicker than the second side.
Public/Granted literature
- US20140110745A1 LIGHT EMITTING DIODE PACKAGE Public/Granted day:2014-04-24
Information query
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