Invention Grant
- Patent Title: Power amplifying module
- Patent Title (中): 功率放大模块
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Application No.: US14196408Application Date: 2014-03-04
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Publication No.: US09287832B2Publication Date: 2016-03-15
- Inventor: Hiroshi Hagisawa , Satoshi Sakurai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2013-042908 20130305
- Main IPC: H03F3/04
- IPC: H03F3/04 ; H03F1/30 ; H03F3/19 ; H03F3/21 ; H03F3/24

Abstract:
A power amplifying module includes a radio frequency amplifying circuit including an amplifying circuit configured to amplify an input signal and output an amplified signal, and a bias circuit of an emitter-follower type configured to bias the amplifying circuit to an operating point, and a constant voltage generating circuit configured to generate, from a first reference voltage, a first constant voltage applied to a base side of a transistor of the bias circuit and a second constant voltage applied to a collector side of the transistor.
Public/Granted literature
- US20140253243A1 POWER AMPLIFYING MODULE Public/Granted day:2014-09-11
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