A twisted differential conductor pair is formed on a circuit board that includes first-third conductors. The second conductor includes first-third portions. The second portion of the second conductor extends between an end of the first conductor and an end of the third conductor, and couples an end of the first portion of the second conductor to an end of the third portion of the second conductor. A solder mask layer is formed over the first, second, and third conductors on the circuit board. An end of the first conductor and the end of the third conductor are exposed through the solder mask layer. The exposed end of the first conductor is coupled to the exposed end of the third conductor over the solder mask layer with a bridge. This configuration may be repeated to create multiple twists along the twisted differential conductor pair.