Invention Grant
US09288916B2 Electronic device, cable coupling structure, and method of fabricating electronic device
有权
电子设备,电缆耦合结构以及制造电子设备的方法
- Patent Title: Electronic device, cable coupling structure, and method of fabricating electronic device
- Patent Title (中): 电子设备,电缆耦合结构以及制造电子设备的方法
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Application No.: US13669862Application Date: 2012-11-06
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Publication No.: US09288916B2Publication Date: 2016-03-15
- Inventor: Mikio Nakamura
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, PC
- Priority: JP2010-107122 20100507
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/09 ; H05K1/00 ; H05K1/18 ; H05K3/40 ; H05K3/32

Abstract:
A structure includes a substrate on a surface of which a functional element and a first electrode are disposed, wherein the functional element provides a predetermined function by an operation based on an electrical signal and the first electrode is coupled to the functional element; an insulating member in a thin film that covers the surface of the substrate and extends from an end of the substrate; and a second electrode disposed on a substrate-side surface of the extending portion, which is extending from the end of the substrate, of the insulating member, wherein the second electrode is coupled to the first electrode. The second electrode is electrically coupled to a coaxial cable.
Public/Granted literature
- US20130062110A1 ELECTRONIC DEVICE, CABLE COUPLING STRUCTURE, AND METHOD OF FABRICATING ELECTRONIC DEVICE Public/Granted day:2013-03-14
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