Invention Grant
- Patent Title: Honeycomb structure
- Patent Title (中): 蜂窝结构
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Application No.: US14221779Application Date: 2014-03-21
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Publication No.: US09289754B2Publication Date: 2016-03-22
- Inventor: Yoshio Kikuchi , Kenichi Hidaka
- Applicant: NGK Insulators, Ltd.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2013-075211 20130329
- Main IPC: B01D50/00
- IPC: B01D50/00 ; B01J27/224 ; C04B37/00 ; C04B38/00

Abstract:
To provide a honeycomb structure capable of using as a catalyst carrier, which suitably functions as a heater by applying a voltage, and where a bonding layer is hard to break; and including a honeycomb segment bonded body where honeycomb segments are bonded by bonding layer, and a pair of electrode members disposed on side surface of the bonded body, wherein the electrode members is formed into a band shape, in a cross section perpendicular to the cell extending direction, the one electrode member is disposed on an opposite side across the center of the bonded body with respect to another electrode member, and in at least a part of the bonding layer, inorganic fibers made of an oxide are included in a porous body where particles of silicon carbide are bound with silicon in a state where pores are held among the particles.
Public/Granted literature
- US20140296054A1 HONEYCOMB STRUCTURE Public/Granted day:2014-10-02
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