Invention Grant
- Patent Title: Coupling assembly
- Patent Title (中): 联轴器组件
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Application No.: US14157815Application Date: 2014-01-17
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Publication No.: US09290134B2Publication Date: 2016-03-22
- Inventor: David T. Renke , Ronald Edward Chupick
- Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Quinn Law Group, PLLC
- Main IPC: B60R13/02
- IPC: B60R13/02 ; B62D27/02 ; F16B5/06

Abstract:
A coupling assembly can couple first and second panels together. The second panel defines a panel hole. The coupling assembly includes a clip configured to be at least partially received in the panel hole. Moreover, the clip extending from the first panel and includes a clip body and at least one resilient leg extending from the clip body. The clip body extends along a longitudinal axis. The clip defines a clip hole extending into the clip body along the longitudinal axis. The coupling assembly further includes an insert comprising a polymer. The insert is at least partially disposed in the clip hole.
Public/Granted literature
- US20150203054A1 COUPLING ASSEMBLY Public/Granted day:2015-07-23
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