Invention Grant
- Patent Title: Blower assembly for electronic device
- Patent Title (中): 电子设备鼓风机总成
-
Application No.: US13930204Application Date: 2013-06-28
-
Publication No.: US09291170B2Publication Date: 2016-03-22
- Inventor: Douglas Heymann
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alpine Technology Law Group LLC
- Main IPC: F04D29/44
- IPC: F04D29/44 ; F04D29/42 ; F04D29/28 ; F04D5/00

Abstract:
In one embodiment a blower comprises a case comprising a first surface, a second surface opposite the first surface, and a side wall extending between portions of the first surface and the second surface, wherein the side wall comprises an air inlet and an air outlet, an impeller disposed in the case and rotatable about an axis of rotation extending through a hub, wherein the impeller comprises a plurality of blades which define a gap with the hub, wherein portions of the side wall are disposed at least a first distance from the axis of rotation and the impeller is to define a circumferential airflow path within the case, wherein the impeller is to create an airflow in the circumferential airflow path between the air inlet and the air outlet, and a feature disposed in the gap to impede recirculation of air in the case.
Public/Granted literature
- US20150003974A1 BLOWER ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2015-01-01
Information query