Invention Grant
- Patent Title: Heated capacitor and method of forming the heated capacitor
- Patent Title (中): 加热电容器和形成加热电容器的方法
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Application No.: US14288433Application Date: 2014-05-28
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Publication No.: US09293254B2Publication Date: 2016-03-22
- Inventor: Honglin Guo , Byron Lovell Williams
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Frank D. Cimino
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01G2/08 ; H01G4/18 ; H01B3/30
Abstract:
A heated capacitor runs current through either a lower metal plate, an upper metal plate, a lower metal trace that lies adjacent to a lower metal plate, an upper metal trace that lies adjacent to an upper metal plate, or both a lower metal trace that lies adjacent to a lower metal plate and an upper metal trace that lies adjacent to an upper metal plate to generate heat from the resistance to remove moisture from a moisture-sensitive insulating layer.
Public/Granted literature
- US20150348708A1 HEATED CAPACITOR AND METHOD OF FORMING THE HEATED CAPACITOR Public/Granted day:2015-12-03
Information query
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