发明授权
- 专利标题： Lead frame with mold lock structure
- 专利标题（中）： 引线框架采用模具锁结构
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申请号： US14220118申请日： 2014-03-19
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公开(公告)号： US09293395B2公开(公告)日： 2016-03-22
- 发明人: Wai Keong Wong , Soo Choong Chee , Stanley Job Doraisamy
- 申请人： Wai Keong Wong , Soo Choong Chee , Stanley Job Doraisamy
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人地址： US TX Austin
- 代理商 Charles E. Bergere
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/31 ; H01L23/00
摘要：
A lead frame for a semiconductor device includes a die paddle and leads situated on a perimeter of the lead frame. The die paddle has a metal frame and a number of substantially linear metal connecting bars within the frame. The connecting bars interconnect different locations of the frame to form a multiple triangles, where a triangular-shaped cavity is formed within each triangle. An overall area of the cavities is greater than an overall area of the connecting bars.
公开/授权文献
- US20150270195A1 LEAD FRAME WITH MOLD LOCK STRUCTURE 公开/授权日：2015-09-24
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