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    SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY
    3.
    发明申请
    SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY 有权
    具有凝胶填充孔的半导体封装

    公开(公告)号：US20150137278A1

    公开(公告)日：2015-05-21

    申请号：US14086919

    申请日：2013-11-21

    申请人： Stanley Job Doraisamy ,  Soon Kang Chan ,  Soo Choong Chee

    发明人： Stanley Job Doraisamy ,  Soon Kang Chan ,  Soo Choong Chee

    IPC分类号： H01L23/31 ,  H01L29/84 ,  H01L21/56

    CPC分类号： H01L29/84 ,  H01L21/50 ,  H01L23/24 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

    摘要： A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to change a top surface of the gel from having a concave shape to a convex shape. The gel is then cured with the jig in place. When the jig is subsequently removed, the cured gel retains the convex shape, which helps to avoid any bond wires from being exposed. The re-shaped gel material reduces internal stresses during thermal cycling and can therefore reduce permanent damage to the package otherwise resulting from such thermal cycling.

    摘要翻译： 使用改变设置在包装中的空腔中的凝胶材料的形状的夹具来组装半导体器件封装。 在一个实施例中，将具有凹底表面的夹具插入到设置在包装壳体中的空腔内的未固化的凝胶材料上，以将凝胶的顶表面从凹形变为凸形。 然后将凝胶用夹具固化就位。 当夹具随后被去除时，固化的凝胶保持凸形，这有助于避免任何接合线暴露。 重新形成的凝胶材料在热循环期间降低内部应力，因此可以减少由于这种热循环导致的对包装的永久性损坏。

    Semiconductor package with gel filled cavity
    4.
    发明授权
    Semiconductor package with gel filled cavity 有权
    具有凝胶填充腔的半导体封装

    公开(公告)号：US09136399B2

    公开(公告)日：2015-09-15

    申请号：US14086919

    申请日：2013-11-21

    申请人： Stanley Job Doraisamy ,  Soon Kang Chan ,  Soo Choong Chee

    发明人： Stanley Job Doraisamy ,  Soon Kang Chan ,  Soo Choong Chee

    IPC分类号： H01L29/84 ,  H01L23/24 ,  H01L21/50

    CPC分类号： H01L29/84 ,  H01L21/50 ,  H01L23/24 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

    摘要： A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to change a top surface of the gel from having a concave shape to a convex shape. The gel is then cured with the jig in place. When the jig is subsequently removed, the cured gel retains the convex shape, which helps to avoid any bond wires from being exposed. The re-shaped gel material reduces internal stresses during thermal cycling and can therefore reduce permanent damage to the package otherwise resulting from such thermal cycling.

    摘要翻译： 使用改变设置在包装中的空腔中的凝胶材料的形状的夹具来组装半导体器件封装。 在一个实施例中，将具有凹底表面的夹具插入到设置在包装壳体中的空腔内的未固化的凝胶材料上，以将凝胶的顶表面从凹形变为凸形。 然后将凝胶用夹具固化就位。 当夹具随后被去除时，固化的凝胶保持凸形，这有助于避免任何接合线暴露。 重新形成的凝胶材料在热循环期间降低内部应力，因此可以减少由于这种热循环导致的对包装的永久性损坏。

    Semiconductor device with twisted leads
    6.
    发明授权
    Semiconductor device with twisted leads 有权
    具有绞线的半导体器件

    公开(公告)号：US09165869B1

    公开(公告)日：2015-10-20

    申请号：US14328713

    申请日：2014-07-11

    申请人： Soo Choong Chee ,  Meng Kong Lye ,  Wai Keong Wong

    发明人： Soo Choong Chee ,  Meng Kong Lye ,  Wai Keong Wong

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49551 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A lead frame for a semiconductor device has a die flag and leads that surround the die flag. In order to decrease the distance or spacing between inner lead ends and the die flag, which allows for short bond wires for connecting the inner lead ends to a die mounted on the die flag, at least some of the leads are twisted along their lengths to be angled with respect to a die-flag plane. The pitch between such twisted leads can be reduced without resulting in physical contact between adjacent leads, enabling the leads to extend further towards the die flag.

    摘要翻译： 用于半导体器件的引线框具有裸片标记和包围裸片标记的引线。 为了减小内引线端和芯片标记之间的距离或间距，这允许用于将内引线端连接到安装在管芯标记上的管芯的短接合线，至少一些引线沿着它们的长度被扭曲到 相对于模具标志平面成角度。 可以减小这种扭绞引线之间的间距，而不会导致相邻引线之间的物理接触，使得引线能够进一步向着模具标记延伸。