Invention Grant
- Patent Title: Semiconductor device with a field ring edge termination structure and a separation trench arranged between different field rings
- Patent Title (中): 具有场环边缘终端结构的半导体器件和布置在不同场环之间的分离沟槽
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Application No.: US14268033Application Date: 2014-05-02
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Publication No.: US09293524B2Publication Date: 2016-03-22
- Inventor: Elmar Falck , Wolfgang Roesener , Hans Peter Felsl , Andre Stegner
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/78 ; H01L29/778 ; H01L29/74 ; H01L29/739 ; H01L21/761

Abstract:
A semiconductor device has a semiconductor body with bottom and top sides and a lateral surface. An active semiconductor region is formed in the semiconductor body and an edge region surrounds the active semiconductor region. A first semiconductor zone of a first conduction type is formed in the edge region. An edge termination structure having at least N field limiting structures is formed in the edge region. Each of the field limiting structures has a field ring and a separation trench formed in the semiconductor body, where N is at least 1. Each of the field rings has a second conduction type, forms a pn-junction with the first semiconductor zone and surrounds the active semiconductor region. For each of the field limiting structures, the separation trench of that field limiting structure is arranged between the field ring of that field limiting structure and the active semiconductor region.
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