Invention Grant
- Patent Title: Processing load distribution
- Patent Title (中): 加工负荷分布
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Application No.: US13642816Application Date: 2012-04-09
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Publication No.: US09294335B2Publication Date: 2016-03-22
- Inventor: Hyoung-Gon Lee
- Applicant: Hyoung-Gon Lee
- Applicant Address: US DE Wilmington
- Assignee: EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Current Assignee: EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Current Assignee Address: US DE Wilmington
- Agency: Brundidge & Stanger, P.C.
- International Application: PCT/US2012/032740 WO 20120409
- International Announcement: WO2013/154522 WO 20131017
- Main IPC: G06F15/16
- IPC: G06F15/16 ; H04L29/08 ; H04N21/24 ; H04N21/442 ; H04N21/6379 ; H04N21/647
Abstract:
Technologies are generally described for dynamically distributing a processing load. In some examples, a method performed under control of a server may include receiving information regarding load distribution from an end device and dynamically distributing a processing load between the server and the end device based at least in part on the information regarding load distribution.
Public/Granted literature
- US20130268573A1 PROCESSING LOAD DISTRIBUTION Public/Granted day:2013-10-10
Information query
