Invention Grant
- Patent Title: Polycrystalline diamond compact including a substrate having a convexly-curved interfacial surface bonded to a polycrystalline diamond table, and related methods and applications
- Patent Title (中): 包括具有与多晶金刚石台结合的凸曲面界面的基材的多晶金刚石压块及其相关方法和应用
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Application No.: US13863465Application Date: 2013-04-16
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Publication No.: US09297212B1Publication Date: 2016-03-29
- Inventor: Alberto Castillo , Jedediah Chad Clarke , Brandon Paul Linford
- Applicant: US Synthetic Corporation
- Applicant Address: US UT Orem
- Assignee: US SYNTHETIC CORPORATION
- Current Assignee: US SYNTHETIC CORPORATION
- Current Assignee Address: US UT Orem
- Agency: Dorsey & Whitney LLP
- Main IPC: E21B10/573
- IPC: E21B10/573

Abstract:
Embodiments of the invention relate to polycrystalline diamond compacts including a substrate having a convexly-curved interfacial surface bonded to a polycrystalline diamond table. In an embodiment, a polycrystalline diamond compact includes a substrate including at least one side surface and a convexly-curved interfacial surface that may, in some embodiments, extend inwardly directly from the at least one side surface to form at least one peripheral edge therebetween. The polycrystalline diamond compact further includes a polycrystalline diamond table bonded to the convexly-curved interfacial surface of the substrate.
Information query
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