Invention Grant
- Patent Title: Pattern dimension measurement method and charged particle beam apparatus
- Patent Title (中): 图案尺寸测量方法和带电粒子束装置
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Application No.: US14001433Application Date: 2011-12-12
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Publication No.: US09297649B2Publication Date: 2016-03-29
- Inventor: Hiroki Kawada , Norio Hasegawa , Toru Ikegami
- Applicant: Hiroki Kawada , Norio Hasegawa , Toru Ikegami
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-037771 20110224
- International Application: PCT/JP2011/006907 WO 20111212
- International Announcement: WO2012/114411 WO 20120830
- Main IPC: G01B15/06
- IPC: G01B15/06 ; G01N23/225 ; H01J37/28 ; H01J37/22 ; G01N23/00 ; H01J37/244

Abstract:
The present invention aims to provide a pattern dimension measurement method for accurately measuring an amount of shrinkage of a pattern that shrinks and an original dimension value before the shrinkage and a charged particle beam apparatus.In order to attain the above-mentioned object, there are proposed a pattern dimension measurement method and a charged particle beam apparatus that are characterized by: forming a thin film on a sample including the pattern after carrying out beam scanning onto a first portion of the pattern; acquiring a first measurement value by scanning a beam onto a region corresponding to the first portion on which the thin film is formed; acquiring a second measurement value by scanning a beam onto a second portion that has identical dimensions as those of the first portion on design data; and finding the amount of shrinkage of the pattern based on subtraction processing of subtracting the first measurement value from the second measurement value.
Public/Granted literature
- US20140048706A1 PATTERN DIMENSION MEASUREMENT METHOD AND CHARGED PARTICLE BEAM APPARATUS Public/Granted day:2014-02-20
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