发明授权
- 专利标题： Wafer stage with reciprocating wafer stage actuation control
- 专利标题（中）： 晶圆台采用往复式晶片台致动控制
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申请号： US13606951申请日： 2012-09-07
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公开(公告)号： US09298106B1公开(公告)日： 2016-03-29
- 发明人: Upendra Ummethala , Marek Zywno , Layton Hale
- 申请人： Upendra Ummethala , Marek Zywno , Layton Hale
- 申请人地址： US CA Milpitas
- 专利权人： KLA-Tencor Corporation
- 当前专利权人： KLA-Tencor Corporation
- 当前专利权人地址： US CA Milpitas
- 代理机构： Suiter Swantz pc llo
- 主分类号： G03F7/20
- IPC分类号： G03F7/20 ; H01L21/68
摘要：
A wafer stage system with reciprocating wafer stage actuation control may include a wafer stage, a motor configured to actuate the wafer stage in a first and/or second direction along an axis, a first reciprocating mechanism configured to decelerate the wafer stage after the wafer stage is actuated to a desired position in the first direction, the first reciprocating mechanism configured to store energy captured while decelerating the wafer stage in the first direction, the first reciprocating mechanism configured to accelerate the wafer stage in the second direction, and a second reciprocating mechanism configured to decelerate the wafer stage after the wafer stage is actuated to a desired position in the second direction, the second reciprocating mechanism configured to store energy captured while decelerating the wafer stage in the second direction, the second reciprocating mechanism further configured to accelerate the wafer stage in the first direction.
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