Invention Grant
- Patent Title: Ad-hoc wireless sensor package
- Patent Title (中): Ad-hoc无线传感器封装
-
Application No.: US13727117Application Date: 2012-12-26
-
Publication No.: US09298945B2Publication Date: 2016-03-29
- Inventor: Jesse R. Cheatham, III , Matthew G. Dyor , Peter N. Glaskowsky , Kimberly D. A. Hallman , Roderick A. Hyde , Muriel Y. Ishikawa , Edward K. Y. Jung , Michael F. Koenig , Robert W. Lord , Richard T. Lord , Craig J. Mundie , Nathan P. Myhrvold , Robert C. Petroski , Desney S. Tan , Lowell L. Wood, Jr.
- Applicant: Elwha LLC
- Applicant Address: US WA Bellevue
- Assignee: Elwha LLC
- Current Assignee: Elwha LLC
- Current Assignee Address: US WA Bellevue
- Agency: Suiter Swantz pc llo
- Main IPC: G05B19/00
- IPC: G05B19/00 ; H04B1/38 ; G06F21/62 ; H04W84/18

Abstract:
Systems, methods, computer-readable storage mediums including computer-readable instructions and/or circuitry for control of transmission to a target device with communicating with one or more sensors in an ad-hoc sensor network may implement operations including, but not limited to: wirelessly transmitting one or more sensor operation activation signals to one or more sensors according to one or more transmission authorization parameters; and powering one or more sensing operations of a sensor via the one or more sensor operation activation signals.
Public/Granted literature
- US20140180639A1 Ad-hoc Wireless Sensor Package Public/Granted day:2014-06-26
Information query
IPC分类: