Invention Grant
- Patent Title: T-shaped contacts for semiconductor device
- Patent Title (中): 用于半导体器件的T形触点
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Application No.: US14281454Application Date: 2014-05-19
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Publication No.: US09299608B2Publication Date: 2016-03-29
- Inventor: Xusheng Wu , Changyong Xiao , Min-hwa Chi
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent Wayne F. Reinke, Esq.
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/768

Abstract:
A transistor, planar or non-planar (e.g., FinFET), includes T-shaped contacts to the source, drain and gate. The top portion of the T-shaped contact is wider than the bottom portion, the bottom portion complying with design rule limits. A conductor-material filled trench through a multi-layer etching stack above the transistor provides the top portions of the T-shaped contacts. Tapered spacers along inner sidewalls of the top contact portion prior to filling allow for etching a narrower bottom trench down to the gate, and to the source/drain for silicidation prior to filling.
Public/Granted literature
- US20150332963A1 T-SHAPED CONTACTS FOR SEMICONDUCTOR DEVICE Public/Granted day:2015-11-19
Information query
IPC分类: