发明授权
- 专利标题： Integrated circuit package and method of making same
- 专利标题（中）： 集成电路封装及其制作方法
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申请号： US12467748申请日： 2009-05-18
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公开(公告)号： US09299661B2公开(公告)日： 2016-03-29
- 发明人: Christopher James Kapusta , James Sabatini
- 申请人： Christopher James Kapusta , James Sabatini
- 申请人地址： US NY Cchenectady
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： US NY Cchenectady
- 代理机构： Ziolkowski Patent Solutions Group, SC
- 代理商 Jean K. Testa
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/48 ; H01L23/538 ; H01L21/56 ; H01L23/31 ; H01L23/00 ; H01L25/065 ; H01L25/10
摘要：
An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side. The package also includes a die having an active surface affixed to a contact location of the first side of the dielectric film. A die stud is affixed to the active surface of the die and extends through the dielectric film to an interconnect location of the second side of the dielectric film.
公开/授权文献
- US20100244235A1 INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME 公开/授权日：2010-09-30
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