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公开(公告)号：US08163596B2
公开(公告)日：2012-04-24
申请号：US12410281
申请日：2009-03-24
IPC分类号： H01L29/66
CPC分类号： H01L23/4985 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L24/18 , H01L24/19 , H01L24/82 , H01L25/105 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2224/18 , H01L2224/73267 , H01L2224/92144 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/18162 , H01L2924/3025
摘要： An apparatus comprises a first chip layer comprising a first component coupled to a first side of a first flex layer, the first component comprising a plurality of electrical pads. The first chip layer also comprises a first plurality of feed-thru pads coupled to the first side of the first flex layer and a first encapsulant encapsulating the first component, the first encapsulant having a portion thereof removed to form a first plurality of cavities in the first encapsulant and to expose the first plurality of feed-thru pads by way of the first plurality of cavities.
摘要翻译： 一种装置包括第一芯片层，其包括耦合到第一柔性层的第一侧的第一部件，所述第一部件包括多个电焊盘。 第一芯片层还包括耦合到第一柔性层的第一侧的第一多个馈通垫和封装第一部件的第一密封剂，第一密封剂的一部分被去除以在其中形成第一多个空腔 第一密封剂并且通过第一多个空腔暴露出第一多个馈通垫。
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公开(公告)号：US09299661B2
公开(公告)日：2016-03-29
申请号：US12467748
申请日：2009-05-18
IPC分类号： H01L21/44 , H01L23/48 , H01L23/538 , H01L21/56 , H01L23/31 , H01L23/00 , H01L25/065 , H01L25/10
CPC分类号： H01L23/5389 , H01L21/561 , H01L21/568 , H01L23/3114 , H01L23/3128 , H01L23/5383 , H01L24/19 , H01L24/96 , H01L25/0655 , H01L25/105 , H01L2224/04105 , H01L2224/20 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/14 , H01L2924/1433 , H01L2924/18162
摘要： An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side. The package also includes a die having an active surface affixed to a contact location of the first side of the dielectric film. A die stud is affixed to the active surface of the die and extends through the dielectric film to an interconnect location of the second side of the dielectric film.
摘要翻译： 集成电路封装包括包括具有第一侧和第二侧的电介质膜的第一电介质层。 封装还包括具有固定到电介质膜的第一侧的接触位置的活性表面的管芯。 模头螺柱固定在模具的有效表面上并且延伸穿过介电膜到电介质膜的第二侧的互连位置。
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公开(公告)号：US09024447B2
公开(公告)日：2015-05-05
申请号：US13418492
申请日：2012-03-13
IPC分类号： H01L23/48 , H01L23/498 , H01L23/538 , H01L23/00 , H01L25/10 , H01L23/31
CPC分类号： H01L23/4985 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L24/18 , H01L24/19 , H01L24/82 , H01L25/105 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2224/18 , H01L2224/73267 , H01L2224/92144 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/18162 , H01L2924/3025
摘要： An apparatus comprises a first chip layer comprising a first component coupled to a first side of a first flex layer, the first component comprising a plurality of electrical pads. The first chip layer also comprises a first plurality of feed-thru pads coupled to the first side of the first flex layer and a first encapsulant encapsulating the first component, the first encapsulant having a portion thereof removed to form a first plurality of cavities in the first encapsulant and to expose the first plurality of feed-thru pads by way of the first plurality of cavities.
摘要翻译： 一种装置包括第一芯片层，其包括耦合到第一柔性层的第一侧的第一部件，所述第一部件包括多个电焊盘。 第一芯片层还包括耦合到第一柔性层的第一侧的第一多个馈通垫和封装第一部件的第一密封剂，第一密封剂的一部分被去除以在其中形成第一多个空腔 第一密封剂并且通过第一多个空腔暴露出第一多个馈通垫。
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公开(公告)号：US08536700B2
公开(公告)日：2013-09-17
申请号：US13101249
申请日：2011-05-05
IPC分类号： H01L23/58
CPC分类号： H01L25/50 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L25/0657 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/73267 , H01L2224/82039 , H01L2224/92144 , H01L2225/0652 , H01L2225/06524 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.
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公开(公告)号：US20100244226A1
公开(公告)日：2010-09-30
申请号：US12463090
申请日：2009-05-08
IPC分类号： H01L23/498 , H01L21/98
CPC分类号： H01L25/50 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L25/0657 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/73267 , H01L2224/82039 , H01L2224/92144 , H01L2225/0652 , H01L2225/06524 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.
摘要翻译： 电子封装包括具有第一表面的第一层，第一层包括具有第一电节点的第一器件和与第一电节点电连通且位于第一表面内的第一接触焊盘。 封装包括具有第二表面和第三表面的第二层，第二层包括位于第二表面内的第一导体和位于第三表面内且与第一导体电连通的第二接触垫。 第一各向异性导电膏（ACP）位于第一接触焊盘和第一导体之间，以将第一接触焊盘电连接到第一导体，使得电信号可以在其间通过。
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公开(公告)号：US10014286B2
公开(公告)日：2018-07-03
申请号：US12463090
申请日：2009-05-08
IPC分类号： H01L25/00 , H01L25/065 , H01L23/00 , H01L23/538 , H01L25/16
CPC分类号： H01L25/50 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L25/0657 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/73267 , H01L2224/82039 , H01L2224/92144 , H01L2225/0652 , H01L2225/06524 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.
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公开(公告)号：US20110210440A1
公开(公告)日：2011-09-01
申请号：US13101249
申请日：2011-05-05
IPC分类号： H01L23/498 , H01L21/98
CPC分类号： H01L25/50 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L25/0657 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/73267 , H01L2224/82039 , H01L2224/92144 , H01L2225/0652 , H01L2225/06524 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.
摘要翻译： 电子封装包括具有第一表面的第一层，第一层包括具有第一电节点的第一器件和与第一电节点电连通且位于第一表面内的第一接触焊盘。 封装包括具有第二表面和第三表面的第二层，第二层包括位于第二表面内的第一导体和位于第三表面内且与第一导体电连通的第二接触垫。 第一各向异性导电膏（ACP）位于第一接触焊盘和第一导体之间，以将第一接触焊盘电连接到第一导体，使得电信号可以在其间通过。
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公开(公告)号：US20110156261A1
公开(公告)日：2011-06-30
申请号：US12410255
申请日：2009-03-24
CPC分类号： H01L24/20 , H01L21/568 , H01L21/6835 , H01L23/3121 , H01L23/5389 , H01L24/19 , H01L25/0655 , H01L2221/68359 , H01L2224/04105 , H01L2224/20 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15174 , H01L2924/15311 , H01L2924/18162
摘要： An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side, the first side having a plurality of contact locations and a plurality of non-contact locations. The package includes a plurality of components, each component having a first surface and a second surface, wherein the first surface of each of the plurality of components is affixed to a corresponding one of the plurality of contact locations of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film.
摘要翻译： 集成电路封装包括第一介电层，其包括具有第一侧和第二侧的电介质膜，第一侧具有多个接触位置和多个非接触位置。 所述封装包括多个部件，每个部件具有第一表面和第二表面，其中所述多个部件中的每一个的所述第一表面固定到所述电介质膜的所述多个接触位置中的对应的一个， 它们之间的粘合剂与电介质膜的材料不同。
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公开(公告)号：US20100244235A1
公开(公告)日：2010-09-30
申请号：US12467748
申请日：2009-05-18
CPC分类号： H01L23/5389 , H01L21/561 , H01L21/568 , H01L23/3114 , H01L23/3128 , H01L23/5383 , H01L24/19 , H01L24/96 , H01L25/0655 , H01L25/105 , H01L2224/04105 , H01L2224/20 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/14 , H01L2924/1433 , H01L2924/18162
摘要： An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side. The package also includes a die having an active surface affixed to a contact location of the first side of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film. A die stud is affixed to the active surface of the die and extends through the dielectric film to an interconnect location of the second side of the dielectric film, and a via is formed through the dielectric film by the die stud.
摘要翻译： 集成电路封装包括包括具有第一侧和第二侧的电介质膜的第一电介质层。 封装还包括具有固定到电介质膜的第一侧的接触位置的活性表面的模具，其间不存在与介电膜的材料不同的粘合剂层。 模头螺柱固定在模具的有效表面上，并延伸穿过电介质膜到介电膜的第二面的互连位置，并且通过模头螺柱形成通孔。
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公开(公告)号：US20100244225A1
公开(公告)日：2010-09-30
申请号：US12410237
申请日：2009-03-24
IPC分类号： H01L23/498 , H01L21/98
CPC分类号： H01L25/50 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L25/0657 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/73267 , H01L2224/82039 , H01L2224/92144 , H01L2225/0652 , H01L2225/06524 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.
摘要翻译： 电子封装包括具有第一表面的第一层，第一层包括具有第一电节点的第一器件和与第一电节点电连通且位于第一表面内的第一接触焊盘。 封装包括具有第二表面和第三表面的第二层，第二层包括位于第二表面内的第一导体和位于第三表面内且与第一导体电连通的第二接触垫。 第一各向异性导电膏（ACP）位于第一接触焊盘和第一导体之间，以将第一接触焊盘电连接到第一导体，使得电信号可以在其间通过。
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