发明授权
- 专利标题: Multi-gate VDMOS transistor
- 专利标题(中): 多门VDMOS晶体管
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申请号: US14795312申请日: 2015-07-09
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公开(公告)号: US09299788B2公开(公告)日: 2016-03-29
- 发明人: Guangyu Sun
- 申请人: Semiconductor Manufacturing International (Beijing) Corporation , Semiconductor Manufacturing International (Shanghai) Corporation
- 申请人地址: CN Beijing CN Shanghai
- 专利权人: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- 当前专利权人: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- 当前专利权人地址: CN Beijing CN Shanghai
- 代理机构: Anova Law Group, PLLC
- 优先权: CN201310342027 20130807
- 主分类号: H01L29/10
- IPC分类号: H01L29/10 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/78
摘要:
Various embodiments provide multi-gate VDMOS transistors. The transistor can include a substrate having a first surface and a second surface opposite to the first surface, a drift layer on the first surface of the substrate, and an epitaxial layer on the drift layer. The transistor can further include a plurality of trenches. Each trench can pass through the epitaxial layer and a thickness portion of the drift layer. The transistor can further include a plurality of gate structures. Each gate structure can fill the each trench. The transistor can further include a plurality of doped regions in the epitaxial layer. Each doped region can surround a sidewall of the each gate structure. The transistor can further include a source metal layer on the epitaxial layer to electrically connecting the plurality of doped regions, and a drain metal layer on the second surface of the substrate.
公开/授权文献
- US20150311288A1 MULTI-GATE VDMOS TRANSISTOR 公开/授权日:2015-10-29
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