Invention Grant
- Patent Title: Device packaging method and device package structure
- Patent Title (中): 器件封装方法和器件封装结构
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Application No.: US14282559Application Date: 2014-05-20
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Publication No.: US09299862B2Publication Date: 2016-03-29
- Inventor: Chung-I Chiang , Yun-Kuei Chiu
- Applicant: Challentech International Corporation
- Applicant Address: TW Zhubei
- Assignee: Challentech International Corporation
- Current Assignee: Challentech International Corporation
- Current Assignee Address: TW Zhubei
- Agency: Wang Law Firm, Inc.
- Priority: TW103106718A 20140227
- Main IPC: H01L31/0203
- IPC: H01L31/0203 ; H01L31/09
Abstract:
A device package method and structure thereof. The method includes steps of: providing a base and a cover, and placing a sensing device on the bottom of cavity base; placing sealant between the cover and edge part of the base, and then covering the cover on the base; irradiating a laser on the edge part for melting the sealant, so as to bond the cover and edge part; and enabling the sealed space formed between the cover and the cavity base to be in vacuum. Therefore, sensing element with high sensitivity can be packaged and manufactured efficiently.
Public/Granted literature
- US20150243799A1 Device Packaging Method and Device Package Structure Public/Granted day:2015-08-27
Information query
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