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公开(公告)号：US20160020377A1
公开(公告)日：2016-01-21
申请号：US14800422
申请日：2015-07-15
Applicant: Challentech International Corporation
Inventor： Chung-I Chiang , Yun-Kuei Chiu
CPC classification number: H01L35/325 , G01K7/01 , H01L27/16 , H01L35/08 , H01L35/10 , H01L35/14 , H01L35/16
Abstract: A wafer level package structure for temperature sensing elements, which includes a wafer cover and a substrate. The wafer cover is formed of infrared penetrable material. The wafer cover has a plurality of package walls, and the plurality of package walls form a plurality of first grooves and a plurality of second grooves in the wafer cover. The substrate includes a plurality of chip areas, a plurality of soldering areas, and a plurality of pin areas. The plurality of chip areas are disposed a temperature sensing chip respectively and correspond to the plurality of first grooves respectively and the plurality of soldering areas solder with respect to the plurality of package walls, such that the plurality of chip areas and the plurality of first grooves form a plurality of vacuum sealed spaces respectively.
Abstract translation: 一种用于温度感测元件的晶片级封装结构，其包括晶片盖和基板。 晶片盖由红外线穿透材料形成。 晶片盖具有多个封装壁，并且多个封装壁在晶片盖中形成多个第一凹槽和多个第二凹槽。 基板包括多个芯片区域，多个焊接区域和多个引脚区域。 多个芯片区域分别配置有温度感测芯片，并且分别对应于多个第一凹槽，并且多个焊接区域相对于多个封装壁焊接，使得多个芯片区域和多个第一凹槽 分别形成多个真空密封空间。
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公开(公告)号：US09672426B2
公开(公告)日：2017-06-06
申请号：US14550707
申请日：2014-11-21
Applicant: Challentech International Corporation
Inventor： Chung-I Chiang , Yun-Kuei Chiu
IPC: H04N9/00 , A61B5/00 , G06K9/00 , H04N5/33 , G08B21/04 , G08B29/18 , G08B21/02 , G08B25/00 , G08B25/08
CPC classification number: G06K9/00771 , G06K9/00342 , G08B21/043 , G08B21/0476 , G08B29/185 , H04N5/33
Abstract: An intelligent monitoring system for care place is illustrated. The system includes a thermal camera capturing a thermal image of the care place; an image processing unit obtaining user's position and number of user according to region in which temperature is higher than a preset temperature in the thermal image; a temperature recording unit extracting and records user's temperature from the thermal image. When there is only one user, a abnormal event determining unit of the system determines whether an abnormal event occurs according to user's temperature changing rate. When there are several users, the abnormal event determining unit determines whether the abnormal event occurs according to both of the temperature changing rates of the users and an average temperature of the users. If the abnormal event occurs, the warning unit generates a warning signal.
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Patent Agency Ranking
公开(公告)号：US20150243799A1
公开(公告)日：2015-08-27
申请号：US14282559
申请日：2014-05-20
Applicant: Challentech International Corporation
Inventor： Chung-I Chiang , Yun-Kuei Chiu
IPC: H01L31/0203 , H01L31/09
CPC classification number: H01L31/0203 , G01J5/045 , H01L21/50 , H01L23/10 , H01L27/14618 , H01L27/14649 , H01L27/14683 , H01L31/09 , H01L2924/15153 , H01L2924/16195 , H01L2924/165
Abstract: A device package method and structure thereof. The method includes steps of: providing a base and a cover, and placing a sensing device on the bottom of cavity base; placing sealant between the cover and edge part of the base, and then covering the cover on the base; irradiating a laser on the edge part for melting the sealant, so as to bond the cover and edge part; and enabling the sealed space formed between the cover and the cavity base to be in vacuum. Therefore, sensing element with high sensitivity can be packaged and manufactured efficiently.
Abstract translation: 一种器件封装方法及其结构。 该方法包括以下步骤：提供基座和盖子，并将感测装置放置在腔体底部; 将密封剂放置在基座的盖和边缘部分之间，然后覆盖基座上的盖; 在边缘部分照射激光以熔化密封剂，以便将盖和边缘部分结合; 并且使得形成在盖和空腔基座之间的密封空间成为真空。 因此，可以有效地包装和制造具有高灵敏度的感测元件。
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公开(公告)号：US09406860B2
公开(公告)日：2016-08-02
申请号：US14800422
申请日：2015-07-15
Applicant: Challentech International Corporation
Inventor： Chung-I Chiang , Yun-Kuei Chiu
CPC classification number: H01L35/325 , G01K7/01 , H01L27/16 , H01L35/08 , H01L35/10 , H01L35/14 , H01L35/16
Abstract: A wafer level package structure for temperature sensing elements, which includes a wafer cover and a substrate. The wafer cover is formed of infrared penetrable material. The wafer cover has a plurality of package walls, and the plurality of package walls form a plurality of first grooves and a plurality of second grooves in the wafer cover. The substrate includes a plurality of chip areas, a plurality of soldering areas, and a plurality of pin areas. The plurality of chip areas are disposed a temperature sensing chip respectively and correspond to the plurality of first grooves respectively and the plurality of soldering areas solder with respect to the plurality of package walls, such that the plurality of chip areas and the plurality of first grooves form a plurality of vacuum sealed spaces respectively.
Abstract translation: 一种用于温度感测元件的晶片级封装结构，其包括晶片盖和基板。 晶片盖由红外线穿透材料形成。 晶片盖具有多个封装壁，并且多个封装壁在晶片盖中形成多个第一凹槽和多个第二凹槽。 基板包括多个芯片区域，多个焊接区域和多个引脚区域。 多个芯片区域分别配置有温度感测芯片，并且分别对应于多个第一凹槽，并且多个焊接区域相对于多个封装壁焊接，使得多个芯片区域和多个第一凹槽 分别形成多个真空密封空间。
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公开(公告)号：US09299862B2
公开(公告)日：2016-03-29
申请号：US14282559
申请日：2014-05-20
Applicant: Challentech International Corporation
Inventor： Chung-I Chiang , Yun-Kuei Chiu
IPC: H01L31/0203 , H01L31/09
CPC classification number: H01L31/0203 , G01J5/045 , H01L21/50 , H01L23/10 , H01L27/14618 , H01L27/14649 , H01L27/14683 , H01L31/09 , H01L2924/15153 , H01L2924/16195 , H01L2924/165
Abstract: A device package method and structure thereof. The method includes steps of: providing a base and a cover, and placing a sensing device on the bottom of cavity base; placing sealant between the cover and edge part of the base, and then covering the cover on the base; irradiating a laser on the edge part for melting the sealant, so as to bond the cover and edge part; and enabling the sealed space formed between the cover and the cavity base to be in vacuum. Therefore, sensing element with high sensitivity can be packaged and manufactured efficiently.
Abstract translation: 一种器件封装方法及其结构。 该方法包括以下步骤：提供基座和盖子，并将感测装置放置在腔体底部; 将密封剂放置在基座的盖和边缘部分之间，然后覆盖基座上的盖; 在边缘部分照射激光以熔化密封剂，以便将盖和边缘部分结合; 并且使得形成在盖和空腔基座之间的密封空间成为真空。 因此，可以有效地包装和制造具有高灵敏度的感测元件。
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公开(公告)号：US20150213317A1
公开(公告)日：2015-07-30
申请号：US14550707
申请日：2014-11-21
Applicant: Challentech International Corporation
Inventor： Chung-I Chiang , Yun-Kuei Chiu
CPC classification number: G06K9/00771 , G06K9/00342 , G08B21/043 , G08B21/0476 , G08B29/185 , H04N5/33
Abstract: An intelligent monitoring system for care place is illustrated. The system includes a thermal camera capturing a thermal image of the care place; an image processing unit obtaining user's position and number of user according to region in which temperature is higher than a preset temperature in the thermal image; a temperature recording unit extracting and records user's temperature from the thermal image. When there is only one user, a abnormal event determining unit of the system determines whether an abnormal event occurs according to user's temperature changing rate. When there are several users, the abnormal event determining unit determines whether the abnormal event occurs according to both of the temperature changing rates of the users and an average temperature of the users. If the abnormal event occurs, the warning unit generates a warning signal.
Abstract translation: 说明了一个用于护理场所的智能监控系统。 该系统包括捕获护理位置的热图像的热像仪; 图像处理单元根据热图像中的温度高于预设温度的区域获得用户的位置和用户数量; 温度记录单元从热图像中提取和记录用户的温度。 当只有一个用户时，系统的异常事件确定单元根据用户的温度变化率来确定是否发生异常事件。 当有多个用户时，异常事件确定单元根据用户的温度变化率和用户的平均温度两者来判定异常事件是否发生。 如果发生异常事件，警告单元会产生警告信号。
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公开(公告)号：US20150213209A1
公开(公告)日：2015-07-30
申请号：US14313158
申请日：2014-06-24
Applicant: Challentech International Corporation
Inventor： Chung-I Chiang , Yun-Kuei Chiu
CPC classification number: H04N5/23206 , G06F19/328 , G06F19/3418 , G06Q30/0283 , H04N5/33
Abstract: A care service transaction method and system thereof. The method includes the following steps: first, a thermal camera and a control apparatus are disposed in a care place. Health data of the user is then received, and a care condition is determined based on the health data, and a transaction amount is determined based on the care condition. The control apparatus is set to control the thermal camera based on the care condition, upon reception of paid information. Therefore, the user can buy suitable intelligent care service, such as care in various time periods, various areas or various care levels, upon his/her demand.
Abstract translation: 护理服务交易方法及其系统。 该方法包括以下步骤：首先，热照相机和控制装置设置在护理位置。 然后接收用户的健康数据，并且基于健康数据确定照顾条件，并且基于照顾条件确定交易量。 控制装置设置为在接收到付费信息时基于照顾条件来控制热摄像机。 因此，用户可以根据自己的需求购买合适的智能护理服务，例如在不同时期，不同领域或各种护理水平的护理。
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