An epoxy resin curing agent which provides good adhesiveness to polyester in addition to excellent performance and high gas-barrier properties of epoxy resins, an epoxy resin composition containing the epoxy resin curing agent, an adhesive for laminating which mainly contains the composition, a laminate film obtained by using the adhesive, a multi-layer packaging material, and a packaging bag. The epoxy resin curing agent is a reaction product of (A) m-xylylenediamine or p-xylylenediamine, (B) a polyfunctional compound having one acyl group, which forms amide linkage by a reaction with polyamine and is capable of forming an oligomer; and (C) an aromatic dicarboxylic acid, an ester thereof, an amide thereof, an acid anhydride thereof, or an acid chloride thereof.