Invention Grant
US09304048B2 Device for emulating temperature of an exothermic composite structure through a thermal cure cycle 有权
用于通过热固化循环模拟放热复合结构的温度的装置

Device for emulating temperature of an exothermic composite structure through a thermal cure cycle
Abstract:
A temperature emulator may include a stacked assembly including a pair of end plates positioned at an uppermost and lowermost location of the stacked assembly, a plurality of heat sink plates positioned between the pair of end plates, a plurality of shim plates positioned between adjacent pairs of heat sink plates, and an exothermic charge assembly positioned between at least one pair of heat sink plates, the exothermic charge assembly including an exotherm charge configured to react exothermally in response to a thermal cure cycle.
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