Invention Grant
- Patent Title: Lithographic method and apparatus
- Patent Title (中): 平版印刷方法和装置
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Application No.: US13767774Application Date: 2013-02-14
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Publication No.: US09304411B2Publication Date: 2016-04-05
- Inventor: Johannes Jacobus Matheus Baselmans , Johannes Christiaan Maria Jasper
- Applicant: ASML Netherlands B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
A method of patterning substrates using a lithographic apparatus. The method comprising providing a beam of radiation using an illumination system, using a patterning device to impart the radiation beam with a pattern in its cross-section, and using a projection system to project the patterned radiation beam onto target portions of a lot of substrates, wherein the method further comprises performing a radiation beam aberration measurement after projecting the patterned radiation beam onto a subset of the lot of substrates, performing an adjustment of the projection system using the results of the radiation beam aberration measurement, then projecting the patterned radiation beam onto a further subset of the lot of substrates.
Public/Granted literature
- US20130235361A1 Lithographic Method and Apparatus Public/Granted day:2013-09-12
Information query
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