Invention Grant
- Patent Title: Electromagnetic relay
- Patent Title (中): 电磁继电器
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Application No.: US14248772Application Date: 2014-04-09
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Publication No.: US09305718B2Publication Date: 2016-04-05
- Inventor: Daiei Iwamoto
- Applicant: FUJITSU COMPONENT LIMITED
- Applicant Address: JP Tokyo
- Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2013-138394 20130701
- Main IPC: H01H3/00
- IPC: H01H3/00 ; H01H1/50 ; H01H50/56 ; H01H51/22 ; H01H1/26
Abstract:
An electromagnetic relay, includes: a first movable contact that comes in contact with a first fixed contact; a second movable contact that comes in contact with a second fixed contact; a first elastic body that biases the first movable contact; a second elastic body that biases the second movable contact; a pressing member that presses the first elastic body and contacts the first movable contact to the first fixed contact, presses the second elastic body and contacts the second movable contact to the second fixed contact; wherein the pressing member contacts the second movable contact to the second fixed contact before contacting the first movable contact to the first fixed contact.
Public/Granted literature
- US20150002248A1 ELECTROMAGNETIC RELAY Public/Granted day:2015-01-01
Information query
