Invention Grant
US09305751B2 Microwave plasma processing apparatus and microwave supplying method
有权
微波等离子体处理装置和微波供应方法
- Patent Title: Microwave plasma processing apparatus and microwave supplying method
- Patent Title (中): 微波等离子体处理装置和微波供应方法
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Application No.: US14326649Application Date: 2014-07-09
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Publication No.: US09305751B2Publication Date: 2016-04-05
- Inventor: Kazushi Kaneko , Toshihiko Iwao , Satoru Kawakami
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, FIgg, Ernst & Manbeck, P.C.
- Priority: JP2013-145045 20130710
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
A microwave plasma processing apparatus includes a processing space; a microwave generator which generates microwaves for generating a plasma; a distributor which distributes the microwaves to a plurality of waveguides; an antenna installed in a processing container to seal the processing space and to radiate microwaves distributed by the distributor, to the processing space; and a monitor unit configured to monitor a voltage of each of the plurality of waveguides. A control unit acquires a control value of a distribution ratio of the distributor, which corresponds to a difference between a voltage monitor value of the monitor unit and a predetermined voltage reference value, from a storage unit that stores the difference and the control value corresponding to each other. The control unit is also configured to control the distribution ratio of the distributor, based on the acquired control value.
Public/Granted literature
- US20150015139A1 MICROWAVE PLASMA PROCESSING APPARATUS AND MICROWAVE SUPPLYING METHOD Public/Granted day:2015-01-15
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