Invention Grant
- Patent Title: Chip package and method for forming the same
- Patent Title (中): 芯片封装及其形成方法
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Application No.: US14596185Application Date: 2015-01-13
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Publication No.: US09305843B2Publication Date: 2016-04-05
- Inventor: Bing-Siang Chen , Chien-Hui Chen , Shu-Ming Chang , Tsang-Yu Liu , Yen-Shih Ho
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Priority: CN201110102543 20110421
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00 ; H01L21/44 ; H01L21/78 ; H01L25/065 ; H01L25/00
Abstract:
An embodiment of the invention provides a chip package which includes: a first chip; a second chip disposed on the first chip, wherein a side surface of the second chip is a chemically-etched surface; and a bonding bulk disposed between the first chip and the second chip such that the first chip and the second chip are bonded with each other.
Public/Granted literature
- US20150162245A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2015-06-11
Information query
IPC分类:
