Invention Grant
US09305843B2 Chip package and method for forming the same 有权
芯片封装及其形成方法

Chip package and method for forming the same
Abstract:
An embodiment of the invention provides a chip package which includes: a first chip; a second chip disposed on the first chip, wherein a side surface of the second chip is a chemically-etched surface; and a bonding bulk disposed between the first chip and the second chip such that the first chip and the second chip are bonded with each other.
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