Invention Grant
- Patent Title: Integrated circuit die with low thermal resistance
- Patent Title (中): 具有低热阻的集成电路管芯
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Application No.: US13210764Application Date: 2011-08-16
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Publication No.: US09305859B2Publication Date: 2016-04-05
- Inventor: Richard K. Williams , Keng Hung Lin
- Applicant: Richard K. Williams , Keng Hung Lin
- Applicant Address: US CA Santa Clara CN Hong Kong
- Assignee: ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED,SKYWORKS SOLUTIONS (HONG KONG) LIMITED
- Current Assignee: ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED,SKYWORKS SOLUTIONS (HONG KONG) LIMITED
- Current Assignee Address: US CA Santa Clara CN Hong Kong
- Agency: Lando & Anastasi, LLP
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/433 ; H01L23/495 ; H01L21/48 ; H01L23/00
Abstract:
In a bump-on-leadframe semiconductor package a metal bump formed on a integrated circuit die is used to facilitate the transfer of heat generated in a semiconductor substrate to a metal heat slug and then to an external mounting surface. A structure including arrays of thermal vias may be used to transfer the heat from the semiconductor substrate to the metal bump.
Public/Granted literature
- US20130043572A1 Bump-On-Leadframe Semiconductor Package With Low Thermal Resistance Public/Granted day:2013-02-21
Information query
IPC分类:
