Invention Grant
- Patent Title: Baseplate for an electronic module and method of manufacturing the same
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Application No.: US14251609Application Date: 2014-04-13
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Publication No.: US09305874B2Publication Date: 2016-04-05
- Inventor: Fabio Brucchi , Davide Chiola
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48
Abstract:
Various embodiments provide a baseplate for an electronic module, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.
Public/Granted literature
- US20150294931A1 Baseplate for an electronic module and method of manufacturing the same Public/Granted day:2015-10-15
Information query
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