公开(公告)号：US09305874B2

公开(公告)日：2016-04-05

申请号：US14251609

申请日：2014-04-13

Applicant: Infineon Technologies AG

Inventor： Fabio Brucchi ,  Davide Chiola

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/13 ,  H01L21/4875 ,  H01L21/4878 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/4924 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/072 ,  H01L25/112 ,  H01L25/115 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0715 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/014

Abstract: Various embodiments provide a baseplate for an electronic module, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.

公开(公告)号：US20160196989A1

公开(公告)日：2016-07-07

申请号：US15070942

申请日：2016-03-15

Applicant: Infineon Technologies AG

Inventor： Fabio BRUCCHI ,  Davide Chiola

IPC: H01L21/48 ,  H01L21/56

CPC classification number: H01L23/13 ,  H01L21/4875 ,  H01L21/4878 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/4924 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/072 ,  H01L25/112 ,  H01L25/115 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0715 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/014

Abstract: Various embodiments provide methods for manufacturing a baseplate for an electronic module and an electronic module comprising a baseplate, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.

Abstract translation: 各种实施例提供了用于制造用于电子模块的基板和包括基板的电子模块的方法，其中所述基板包括导电材料; 以及形成在基板的一个主表面中并适于容纳电子芯片的凹部。

公开(公告)号：US10109544B2

公开(公告)日：2018-10-23

申请号：US15630750

申请日：2017-06-22

Applicant: Infineon Technologies AG

Inventor： Fabio Brucchi ,  Davide Chiola

IPC: H01L23/043 ,  H01L23/13 ,  H01L23/00 ,  H01L23/31 ,  H01L25/07 ,  H01L25/11 ,  H01L21/48 ,  H01L23/492 ,  H01L23/367 ,  H01L23/373 ,  H01L21/56

Abstract: Various embodiments provide an electronic module comprising a baseplate. A recess is formed in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip. The electronic chip is attached to a substrate or carrier and is placed in the recess.

公开(公告)号：US09716018B2

公开(公告)日：2017-07-25

申请号：US15070942

申请日：2016-03-15

Applicant: Infineon Technologies AG

Inventor： Fabio Brucchi ,  Davide Chiola

IPC: H01L21/00 ,  H01L21/48 ,  H01L23/498 ,  H01L23/13 ,  H01L23/36 ,  H01L23/373 ,  H01L25/11 ,  H01L21/56

CPC classification number: H01L23/13 ,  H01L21/4875 ,  H01L21/4878 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/4924 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/072 ,  H01L25/112 ,  H01L25/115 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0715 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/014

Abstract: Various embodiments provide methods for manufacturing a baseplate for an electronic module and an electronic module comprising a baseplate, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.