Invention Grant
US09305895B2 Substrates having ball lands, semiconductor packages including the same, and methods of fabricating semiconductor packages including the same
有权
具有球形接地面的基板，包括其的半导体封装以及制造包括该基板的半导体封装的方法
- Patent Title: Substrates having ball lands, semiconductor packages including the same, and methods of fabricating semiconductor packages including the same
- Patent Title (中): 具有球形接地面的基板，包括其的半导体封装以及制造包括该基板的半导体封装的方法
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Application No.: US14262537Application Date: 2014-04-25
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Publication No.: US09305895B2Publication Date: 2016-04-05
- Inventor: Jong Woo Yoo , Qwan Ho Chung
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon
- Assignee: SK HYNIX INC.
- Current Assignee: SK HYNIX INC.
- Current Assignee Address: KR Icheon
- Priority: KR10-2013-0144115 20131125
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H05K1/11 ; H01L23/31 ; H01L23/498 ; H05K3/40
Abstract:
A package substrate includes a core layer having a first surface and a second surface which are opposite to each other, a ball land pad disposed on the first surface of the core layer, an opening that penetrates the core layer to expose the ball land pad, and a dummy ball land disposed on the second surface of the core layer to surround the opening. The dummy ball land includes at least one sub-pattern and at least one vent hole. Related semiconductor packages and related methods are also provided.
Public/Granted literature
Information query
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