公开(公告)号：US09305895B2

公开(公告)日：2016-04-05

申请号：US14262537

申请日：2014-04-25

Applicant: SK hynix Inc.

Inventor： Jong Woo Yoo ,  Qwan Ho Chung

IPC: H01L23/00 ,  H05K1/11 ,  H01L23/31 ,  H01L23/498 ,  H05K3/40

CPC classification number: H01L24/81 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/81191 ,  H01L2224/81447 ,  H01L2224/85181 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/113 ,  H05K3/4007 ,  H05K2201/09663 ,  H05K2203/1178 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A package substrate includes a core layer having a first surface and a second surface which are opposite to each other, a ball land pad disposed on the first surface of the core layer, an opening that penetrates the core layer to expose the ball land pad, and a dummy ball land disposed on the second surface of the core layer to surround the opening. The dummy ball land includes at least one sub-pattern and at least one vent hole. Related semiconductor packages and related methods are also provided.

Abstract translation: 封装基板包括具有彼此相对的第一表面和第二表面的芯层，设置在芯层的第一表面上的焊盘焊盘，穿过芯层以露出焊盘焊盘的开口， 以及设置在芯层的第二表面上以围绕开口的虚拟球形区域。 虚拟球场包括至少一个子图案和至少一个通气孔。 还提供了相关的半导体封装和相关方法。